Patents by Inventor Kenjiro Ogata

Kenjiro Ogata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High removal rate chemical mechanical polishing pads and methods of making
    Patent number: 10722999
    Abstract: A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising (i) one or more diisocyanate, polyisocyanate or polyisocyanate prepolymer, (ii) from 40 to 85 wt. % based on the total weight of (i) and (ii) of one or more blocked diisocyanate, polyisocyanate or polyisocyanate prepolymer which contains a blocking agent and has a deblocking temperature of from 80 to 160° C., and (iii) one or more aromatic diamine curative. The reaction mixture has a gel time at 80° C. and a pressure of 101 kPa of from 2 to 15 minutes; the polyurethane reaction product has a residual blocking agent content of 2 wt. % or less; and the polishing layer exhibits a density of from 0.6 to 1.2 g/cm3.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: July 28, 2020
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Nitta Haas Inc., Dow Global Technologies LLC
    Inventors: Thomas P. Willumstad, Bainian Qian, Rui Xie, Kenjiro Ogata, George C. Jacob, Marty W. DeGroot
  • HIGH REMOVAL RATE CHEMICAL MECHANICAL POLISHING PADS AND METHODS OF MAKING
    Publication number: 20170361421
    Abstract: A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising (i) one or more diisocyanate, polyisocyanate or polyisocyanate prepolymer, (ii) from 40 to 85 wt. % based on the total weight of (i) and (ii) of one or more blocked diisocyanate, polyisocyanate or polyisocyanate prepolymer which contains a blocking agent and has a deblocking temperature of from 80 to 160° C., and (iii) one or more aromatic diamine curative. The reaction mixture has a gel time at 80° C. and a pressure of 101 kPa of from 2 to 15 minutes; the polyurethane reaction product has a residual blocking agent content of 2 wt. % or less; and the polishing layer exhibits a density of from 0.6 to 1.2 g/cm3.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 21, 2017
    Inventors: Thomas P. Willumstad, Bainian Qian, Rui Xie, Kenjiro Ogata, George C. Jacob, Marty W. DeGroot