Patents by Inventor Kenju TSUCHIYA

Kenju TSUCHIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing circuit board and circuit board
    Patent number: 10206287
    Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: February 12, 2019
    Assignee: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Kosuke Tsuji, Kazunori Koike, Katsura Kawashima, Kenju Tsuchiya, Shinji Imai
  • METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD
    Publication number: 20170034920
    Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.
    Type: Application
    Filed: November 28, 2014
    Publication date: February 2, 2017
    Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Kosuke TSUJI, Kazunori KOIKE, Katsura KAWASHIMA, Kenju TSUCHIYA, Shinji IMAI