Patents by Inventor Kenkichi Arai

Kenkichi Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6259038
    Abstract: A semiconductor chip mounting circuit board includes a substrate, a wiring circuit formed on a substrate, a conducting pad electrically connected to an electrode of a semiconductor chip which is to be mounted on the substrate. An insulating resist layer is formed on the substrate to cover the wiring circuit and the resist layer has an opening to expose therein the conducting pad. A conducting bump is formed on the conducting pad exposed in the opening. A resist layer has a measuring opening which exposes a reference surface. A height of the conducting bump can be measured by an optical means using the measuring opening.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: July 10, 2001
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Naoyuki Koizumi, Kenkichi Arai