Abstract: A method of continuously subjecting an elongated substrate to vacuum film formation is disclosed. The method comprises the steps of: feeding a first substrate from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the first substrate; forming a film of a second material on the first substrate, in a second film formation chamber; and rolling up the first substrate in the second roll chamber, thereby producing the first substrate, and comprises similar steps to produce a second substrate. In advance of producing the first substrate with the second material film, the first cathode electrode of the first film formation chamber is removed from the first film formation chamber, and, in advance of producing the second substrate with the first material film, the second cathode electrode of the second film formation chamber is removed from the second film formation chamber.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the substrate fed in the first direction; forming a second material film on the first surface of the substrate in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the second material film formed thereon; unrolling and feeding the substrate from the second roll chamber in a second direction from the second roll chamber toward the first roll chamber; forming a first material film on the second material film in a first film formation chamber; taking up the substrate in a roll form in the first roll chamber.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the fed substrate; forming a first material film on a first surface in a first film formation chamber; guiding the substrate having the first material film formed thereon to a second film formation chamber in a second direction from the second roll chamber toward the first roll chamber; forming, in the second film formation chamber, a second material film on a second surface opposite the first surface of the substrate when it is being guided in the second direction; taking up, in a third roll chamber provided between the first roll chamber and the second roll chamber, the substrate in a roll state.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the substrate fed in the first direction; forming a second material film on the first surface of the substrate in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the second material film formed thereon; unrolling and feeding the substrate from the second roll chamber in a second direction from the second roll chamber toward the first roll chamber; forming a first material film on the second material film in a first film formation chamber; taking up the substrate in a roll form in the first roll chamber.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the fed substrate; forming a first material film on a first surface in a first film formation chamber; guiding the substrate having the first material film formed thereon to a second film formation chamber in a second direction from the second roll chamber toward the first roll chamber; forming, in the second film formation chamber, a second material film on a second surface opposite the first surface of the substrate when it is being guided in the second direction; taking up, in a third roll chamber provided between the first roll chamber and the second roll chamber, the substrate in a roll state.

Abstract: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.

Abstract: A method of continuously subjecting an elongated substrate to vacuum film formation is disclosed. The method comprises the steps of: feeding a first substrate from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the first substrate; forming a film of a second material on the first substrate, in a second film formation chamber; and rolling up the first substrate in the second roll chamber, thereby producing the first substrate, and comprises similar steps to produce a second substrate. In advance of producing the first substrate with the second material film, the first cathode electrode of the first film formation chamber is removed from the first film formation chamber, and, in advance of producing the second substrate with the first material film, the second cathode electrode of the second film formation chamber is removed from the second film formation chamber.

Abstract: A wired circuit board holding sheet that can permit easy judgment on whether a cutting notch formed has a predetermined depth, and a production method of the wired circuit board holding sheet that can produce the wired circuit board holding sheet simply and easily. In the wired circuit board holding sheet 1 comprising a sheet 2 holding therein a plurality of separable wired circuit boards 3, the respective wired circuit boards 3 are held in the sheet 2 via joints 4 to be cut, and cutting notches 6 to facilitate cutting of the joints 4 and marking notches 7 to indicate that the cutting notches 6 have a predetermined depth to cut the joints 4 are formed simultaneously in both front and back surfaces of the joints 4 by using punches having combination of a main punch portion 13 and a sub-punch portion 14.

Abstract: A wired circuit board holding sheet that can permit easy judgment on whether a cutting notch formed has a predetermined depth, and a production method of the wired circuit board holding sheet that can produce the wired circuit board holding sheet simply and easily. In the wired circuit board holding sheet 1 comprising a sheet 2 holding therein a plurality of separable wired circuit boards 3, the respective wired circuit boards 3 are held in the sheet 2 via joints 4 to be cut, and cutting notches 6 to facilitate cutting of the joints 4 and marking notches 7 to indicate that the cutting notches 6 have a predetermined depth to cut the joints 4 are formed simultaneously in both front and back surfaces of the joints 4 by using punches having combination of a main punch portion 13 and a sub-punch portion 14.

Abstract: A wired circuit board holding sheet that can permit easy judgment on whether a cutting notch formed has a predetermined depth, and a production method of the wired circuit board holding sheet that can produce the wired circuit board holding sheet simply and easily. In the wired circuit board holding sheet 1 comprising a sheet 2 holding therein a plurality of separable wired circuit boards 3, the respective wired circuit boards 3 are held in the sheet 2 via joints 4 to be cut, and cutting notches 6 to facilitate cutting of the joints 4 and marking notches 7 to indicate that the cutting notches 6 have a predetermined depth to cut the joints 4 are formed simultaneously in both front and back surfaces of the joints 4 by using punches having combination of a main punch portion 13 and a sub-punch portion 14.

Abstract: A wired circuit board holding sheet that can permit easy judgment on whether a cutting notch formed has a predetermined depth, and a production method of the wired circuit board holding sheet that can produce the wired circuit board holding sheet simply and easily. In the wired circuit board holding sheet 1 comprising a sheet 2 holding therein a plurality of separable wired circuit boards 3, the respective wired circuit boards 3 are held in the sheet 2 via joints 4 to be cut, and cutting notches 6 to facilitate cutting of the joints 4 and marking notches 7 to indicate that the cutting notches 6 have a predetermined depth to cut the joints 4 are formed simultaneously in both front and back surfaces of the joints 4 by using punches having combination of a main punch portion 13 and a sub-punch portion 14.

Abstract: The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm2 with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm2, not more than 1.5×10−5/° C., a hygroscopic expansion coefficient of not more than 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C.