Patents by Inventor Kenlin C. Huang

Kenlin C. Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self aligned double patterning flow with non-sacrificial features
    Patent number: 7972959
    Abstract: Embodiments of the present invention pertain to methods of forming features on a substrate using a self-aligned double patterning (SADP) process. A conformal layer of non-sacrificial material is formed over features of sacrificial structural material patterned near the optical resolution of a photolithography system using a high-resolution photomask. An anisotropic etch of the non-sacrificial layer leaves non-sacrificial ribs above a substrate. A gapfill layer deposited thereon may be etched or polished back to form alternating fill and non-sacrificial features. No hard mask is needed to form the non-sacrificial ribs, reducing the number of processing steps involved.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: July 5, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Bencherki Mebarki, Li Yan Miao, Kenlin C. Huang
  • SELF ALIGNED DOUBLE PATTERNING FLOW WITH NON-SACRIFICIAL FEATURES
    Publication number: 20100136784
    Abstract: Embodiments of the present invention pertain to methods of forming features on a substrate using a self-aligned double patterning (SADP) process. A conformal layer of non-sacrificial material is formed over features of sacrificial structural material patterned near the optical resolution of a photolithography system using a high-resolution photomask. An anisotropic etch of the non-sacrificial layer leaves non-sacrificial ribs above a substrate. A gapfill layer deposited thereon may be etched or polished back to form alternating fill and non-sacrificial features. No hard mask is needed to form the non-sacrificial ribs, reducing the number of processing steps involved.
    Type: Application
    Filed: December 1, 2008
    Publication date: June 3, 2010
    Applicant: Applied Materials, Inc.
    Inventors: Bencherki Mebarki, Li Yan Miao, Kenlin C. Huang