Abstract: Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

Abstract: Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

Abstract: Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

Abstract: Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

Abstract: A process for preparing a particle comprising a biological molecule typically a DNA plasmid, and a carrier polymer, typically poly-lactic acid (PLA), in which an organic solvent solution of the biological molecule and the carrier polymer in an organic solvent medium, nearly saturated with the biological molecule, is prepared, then this solution is contacted with an antisolvent substance, typically supercritical carbon dioxide to separate a particle comprising the biological molecule and the carrier polymer. High loadings of the biological molecule in the particle can be achieved.

Abstract: Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

Abstract: Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

Abstract: A metering and dispensing closure for a container wherein two rotatable disks rotate in conjunction with a stationary cap member to afford accurate measuring of a powder material and dispensing of it. The disks and the container cap afford a consistent measuring of the powder material, as well as provide a variety of drive members which can be utilized with the dispensing closure.

Abstract: A metering and dispensing closure for a container wherein two rotatable disks rotate in conjunction with a stationary cap member to afford accurate measuring of a powder material and dispensing of it. The disks and the container cap afford a consistent measuring of the powder material, as well as provide a variety of drive members which can be utilized with the dispensing closure.

Abstract: Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

Abstract: The present invention relates generally to new planar substrates that are metallized and embedded with material to minimize the camber and method thereof. The invention also relates to the fabrication of multilayer ceramic (MLC) substrates for packaging electronic devices. More particularly, this invention relates to the fabrication of thin and small ceramic substrates which do not need post-sintering processing to control the flatness of the sintered product.

Abstract: An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to the terraced contour of the inner sidewall.

Abstract: A method and apparatus for the inspection and handling of surface level defects is taught. Briefly stated, the object to be inspected is positioned. A Laser light is polarized into at least one orientation and then reflected off of a rotated polygon mirror. This causes the light to "move" over the area of interest. A plurality of fiber optic bundles are used to receive and conduct the reflected light back to photomultipliers. The photomultipliers convert the light into electrical signals while associated electronics digitize the signals, keeping track of pixels which are produced. By keeping track of pixel edge boundaries and determining if certain thresholds are exceeded or not met as appropriate, the area of interest can be checked for a variety of defects. By comparison of the defects to a reference base, the defects and hence the items inspected can be categorized.

Abstract: A method and apparatus for the inspection and handling of surface level defects is taught. Briefly stated, the object to be inspected is positioned. A Laser light is polarized into at least one orientation and then reflected off of a rotated polygon mirror. This causes the light to "move" over the area of interest. A plurality of fiber optic bundles are used to receive and conduct the reflected light back to photomultipliers. The photomultiplers convert the light into electrical signals while associated electronics digitize the signals, keeping track of pixels which are produced. By keeping track of pixel edge boundaries and determining if certain thresholds are exceeded or not met as appropriate, the area of interest can be checked for a variety of defects. By comparison of the defects to a reference base, the defects and hence the items inspected can be categorized.