Publication number: 20220235516
Abstract: A new technique for treating non-PAN-based pre-cursor polymeric fibers, tows, yarns, and films has been created for use in making stabilized pre-cursor polymers. By applying stepwise or non-stepwise microwave and/or ultraviolet radiation to the pre-cursor polymeric fibers, tows, yarn, or films prior to the stabilization thereof, a reduction in time for the costly stabilization process is achieved. Application of this technique extends to less-costly production of carbon fibers, for uses in industries such as automotive, aviation, trains, medical, military, sporting goods, orthopedics, and other industries. The pre-cursor polymeric fibers, tows, yarns, or films may be a multi-component polymer composite comprised of a non-PAN-based polymeric fiber, tow, yarn, or film and at least one or more constituent materials. Carbonization of such pre-cursor polymeric fibers, tows, yarns, or films results in less-costly carbon fibers that perform equally, if not better, than traditional costly PAN-based carbon fibers.
Type:
Application
Filed:
June 10, 2020
Publication date:
July 28, 2022
Applicant:
University of Virginia Patent Foundation
Inventors:
Xiaodong Li, Zan Gao, Jiadeng Zhu, Yellapu V. Murty, Kenneth Brown, Clifton Bumgardner
Publication number: 20220155539
Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.
Type:
Application
Filed:
November 19, 2020
Publication date:
May 19, 2022
Inventors:
Srinivas V. PIETAMBARAM, Brandon C. MARIN, Sameer PAITAL, Sai VADLAMANI, Rahul N. MANEPALLI, Xiaoqian LI, Suresh V. POTHUKUCHI, Sujit SHARAN, Arnab SARKAR, Omkar KARHADE, Nitin DESHPANDE, Divya PRATAP, Jeremy ECTON, Debendra MALLIK, Ravindranath V. MAHAJAN, Zhichao ZHANG, Kemal AYGÜN, Bai NIE, Kristof DARMAWIKARTA, James E. JAUSSI, Jason M. GAMBA, Bryan K. CASPER, Gang DUAN, Rajesh INTI, Mozhgan MANSURI, Susheel JADHAV, Kenneth BROWN, Ankar AGRAWAL, Priyanka DOBRIYAL