Abstract: A circuit module testing apparatus and method are provided. According to various embodiments, a circuit module testing apparatus includes a printed circuit board, a socket receptacle adapted to be connected to the printed circuit board, a socket having pins on a first side, the pins adapted to be removably inserted into the socket receptacle, the socket adapted to receive a circuit module for testing, and a test circuit board soldered to the first side of the socket, the test circuit board having selected pins shorted for testing the module and clipped to prevent engagement with the socket receptacle. According to one embodiment, the test circuit board has selected pins shorted for interconnect built-in self-testing (IBIST). Other aspects and embodiments are provided herein.

Abstract: A circuit module testing apparatus and method are provided. According to various embodiments, a circuit module testing apparatus includes a printed circuit board, a socket receptacle adapted to be connected to the printed circuit board, a socket having pins on a first side, the pins adapted to be removably inserted into the socket receptacle, the socket adapted to receive a circuit module for testing, and a test circuit board soldered to the first side of the socket, the test circuit board having selected pins shorted for testing the module and clipped to prevent engagement with the socket receptacle. According to one embodiment, the test circuit board has selected pins shorted for interconnect built-in self-testing (IBIST). Other aspects and embodiments are provided herein.