Abstract: A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Abstract: An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g.

Abstract: A method is disclosed for pre-release plastic packaging of MEMS and IMEMS devices. The method can include encapsulating the MEMS device in a transfer molded plastic package. Next, a perforation can be made in the package to provide access to the MEMS elements. The non-ablative material removal process can include wet etching, dry etching, mechanical machining, water jet cutting, and ultrasonic machining, or any combination thereof. Finally, the MEMS elements can be released by using either a wet etching or dry plasma etching process. The MEMS elements can be protected with a parylene protective coating. After releasing the MEMS elements, an anti-stiction coating can be applied. The perforating step can be applied to both sides of the device or package. A cover lid can be attached to the face of the package after releasing any MEMS elements. The cover lid can include a window for providing optical access.

Abstract: An exterior rearview mirror assembly for use on an automotive vehicle comprises a base member having a mounting plate for fixedly securing the mirror assembly to the side of the vehicle and a base plate extending outwardly therefrom. An elongated support arm has a first end pivotally coupled to the base plate and an opposite second end supporting a concave mirror housing. The mirror housing includes a peripheral rim defining an opening for receiving a reflective glass mirror pane. The mirror pane includes a directional indicator for providing directional signalling of the intended vehicle path. The mirror assembly further includes a puddle lamp for illuminating areas adjacent to the vehicle for entry and exit and for signalling rearward of the vehicle. Finally, the mirror assembly includes a display panel operatively connected to the vehicle for displaying information indicative of the vehicles operating conditions.

Abstract: The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof.

Abstract: Pumps, for example, bilge pumps, comprise a pump housing including an inlet and an outlet, a motor and an impeller assembly coupled to the motor for pumping liquid which passes through the outlet. The motor is advantageously cooled by pumped liquid while being protected from the pumped liquid. Further, the motor is turned on and off in response to actual operating conditions, thereby increasing pump life and reducing overall power consumption. The pump provides contoured facing surfaces which provide a dynamically efficient flow path for the pumped liquid. In addition, a switch housing is preferably provided to allow liquid to contact an activator assembly which turns the motor on.

Abstract: An electron beam apparatus and method for testing a circuit. The electron beam apparatus comprises an electron beam incident on an outer surface of an insulating layer overlying one or more electrical conductors of the circuit for generating a time varying or alternating current electrical potential on the surface; and a measurement unit connected to the circuit for measuring an electrical signal capacitively coupled to the electrical conductors to identify and map a conduction state of each of the electrical conductors, with or without an electrical bias signal being applied to the circuit. The electron beam apparatus can further include a secondary electron detector for forming a secondary electron image for registration with a map of the conduction state of the electrical conductors.

Abstract: The apparatus comprises means for replaceable coupling thereof to a standard raise boring head for extending the effective cutting radius of the head. The apparatus comprises a raise boring head radius extension element which is pinned to struts extending from a circular hub; the hub, in turn, envelops a terminal end of the stem of the raise boring head. Additionally, pin-holed clevises borne by the extension elements mate with like pin-holed lugs which extend, radially, from the principal cutter bracket mounting platform of the standard raise boring head. Expansion pins are engaged with the lugs and clevises, and also secure the struts both to the hub and to the extension element, to simplify assembly and disassembly. In typical use, a plurality of radius extension elements are coupled to the standard raise boring head, the elements being arrayed circumferentially thereabout.