Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A static random access memory (SRAM) (10) operating in synchronism with an external clock is disclosed. The synchronous SRAM (10) includes a transparent address circuit (14) for decoding an external address in the set-up time prior to the rising edge of the external clock. A timing and control circuit (18) generates a word line enable (WLE) signal in synchronism with the rising edge of the external clock. When active, WLE activates a word line driver (34), when inactive, WLE equalizes the bit lines. WLE is applied to a first delay circuit (60) to generate a sense signal (SA). SA activates a sense circuit (46) and deactivates the WLE signal. Consecutive pipelined accesses are achieved such that, as an address is decoded, the bit lines are equalizing and the data from the previous address are propagating through a data I/O path (16).

Abstract: A static random access memory (SRAM) (10) operating in synchronism with an external clock is disclosed. The synchronous SRAM (10) includes a transparent address circuit (14) for decoding an external address in the set-up time prior to the rising edge of the external clock. A timing and control circuit (18) generates a word line enable (WLE) signal in synchronism with the rising edge of the external clock. When active, WLE activates a word line driver (34), when inactive, WLE equalizes the bit lines. WLE is applied to a first delay circuit (60) to generate a sense signal (SA). SA activates a sense circuit (46) and deactivates the WLE signal. Consecutive pipelined accesses are achieved such that, as an address is decoded, the bit lines are equalizing and the data from the previous address are propagating through a data I/O path (16).

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A smart memory (10) is provided that includes data storage (12 and 18) and a processing core (14 and 16) for executing instructions stored in the data storage area (12 and 18). Externally, smart memory (10) is directly accessible as a standard memory device. In a first mode of operation, the smart memory (10) is a data storage facility for an associated central processing unit (22). In a second mode of operation, the smart memory (10) is a storage facility for the processing core (14 and 16) and for central processing unit (22) for simultaneous execution of instructions. The central processing unit (22) controls the mode of operation and determines the instructions executed by the processing core (14 and 16). The wide data bus, available with an integrated processor/storage facility, permits certain processing operations to be off-loaded to the smart memory (10) where the processing operations can be performed more efficiently.

Abstract: A word line driver circuit (10) for driving four word lines (18) is disclosed. In a preferred embodiment, the word line driver circuit (10) includes a decoder circuit (12) for pulling a decode node (20) to a logic low level (Vss) in response to internal row decode signals, a pull-up circuit (14) for pulling the decode node (20) to a logic high (Vcc) to deselect the word lines (18), four transfer transistors (NO) intermediate the decode node (20) and four control nodes (22), four CMOS inverters (18), each driving one word line (18) between a boost voltage and Vss. A PMOS level shifter transistor (P0) is associated with each inverter (18), and has a channel width that is small relative to both the channel widths of the transfer transistors (N0) and to the devices making up the decoder circuit (12), allowing the level shifter transistors (P0) to be overpowered by the decoder circuit (12).

Abstract: A burst dynamic random access memory (DRAM) (10) is disclosed having memory cells arranged in a number of quadrants (22), each quadrant including local I/O lines (24) for accessing the memory cells therein. The local I/O lines (24) of each quadrant are commonly coupled to global I/O lines (26) by tri-state driver banks (30). According to a row address and a first portion of a column address, a row decoding circuit (36) and column decoding circuit (40) couple one set of local I/O lines (24) within each quadrant (22) to selected columns within the quadrants (22). A bank sequencer (48) receives a second portion of the column address and generates burst sequence of different bank select signals. Each bank select signal enables a different set of tri-state driver banks (30). The enabled tri-state driver banks (30) provide a data path between the local I/O lines (24) and the global I/O lines.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: A timing control circuit (10) is disclosed that provides a timing circuit (12) for controlling the operation of an I/O path circuit (14) in a synchronous static random access memory (SRAM). In a read or write operation, the timing circuit (12) sequentially disables bit line equalization circuits (34), enables sense amplifiers (38), disables I/O line equalization circuits (42), and enables secondary sense amplifiers (44). Further, the timing control (12) initiates a reset operation prior to the completion of the read or write operation. The reset operation includes sequentially enabling the bit line equalization circuits (34), disabling the sense amplifiers (38), enabling the I/O line equalization circuits (42), and disabling the secondary sense amplifiers (44). The timing circuit (12) includes first, second and third delay circuits (20, 22, and 24) to allow for minimum split times for bit line pairs (32) and I/O line pairs (40), and minimum secondary sense amplifier (44) sensing times.

Abstract: A dual-port semiconductor memory device is disclosed that includes a number of array blocks (12) having memory cells disposed in rows and local columns, with each local column having a local bit line pair (30). A sense amplifier row (28) is associated with each array block (12) and includes a sense amplifier (28) coupled to each local bit line pair (30). Each sense amplifier row (14) is commonly connected through a number of bit line gates (32) to global bit line pairs (26) disposed on a higher fabrication layer than that of the local bit lines (30). A block decode signal commonly activates all the bit line gates (32) of one array block to couple the global bit lines (26) to one sense amplifier row (14). The global bit lines (26) are also connected to a column decoding section (18) which provides random input/output selection of a global bit line pair (26). A latch row (20) is also coupled to the global bit lines ( 26) through a number of latch gates (42).

Abstract: A semiconductor random access memory (RAM) is disclosed having a number of array blocks (14), each array block (14) including standard rows, standard columns, redundant rows (24) and redundant columns (26). A row redundancy circuit (44) is provided for each array block that includes a single row fuse bank (28). Within the row fuse bank (28) are row disable fuses (42) and redundant row fuses (54) interspersed at regular intervals between the row disable fuses (42). Each row disable fuse (42) disables a standard row segment (32) when opened. A redundant row segment (46) is driven according to the combination of opened redundant row fuses (54). A column redundancy circuit (62) includes a number of column fuses (64) disposed in a column fuse bank (30). Redundant columns (26) are enabled by opening selected ones of the column fuses (64). If a redundant column (26) is driven the remaining standard columns of its associated array block (14) are disabled.

Abstract: An oscillator (108) for a standby charge pump (102,104)in a dynamic random access memory part (30) includes a fuse (136). The fuse can be blown after testing the part while selecting redundant memory cells to reduce the frequency of the oscillator and obtain a lower power part. The oscillator (108) also drives the on-chip self-refresh circuits (106) that operate slower in response to the reduced frequency. Selecting redundant circuits also includes eliminating memory cells that pass the pause test, but by only a certain margin. Reducing the frequency of the oscillator driving the self-refresh circuits would otherwise cause failure of the cells that pass the pause test by only the certain margin. The oscillator circuit includes a ring of inverter stages (112) and a fused voltage bias circuit (110) generating one or another set of bias voltages (118,120) to the ring oscillator to alter its frequency of oscillation.

Abstract: Switching circuits controlled by a fuse that can be blown after testing the DRAM part select the timing signals coupled from a binary counter to internal signal generator circuits. The internal Circuits control self refresh in this embodiment. The decision to leave the fuse intact or blow the fuse rests on the test results obtained from each part and can vary depending upon maturity of the manufacturing process, the pause test results obtained and whether a low power part is desired. The fuse is affected after fabrication of the chip and at the same time as other fuses used for redundancy. This provides another degree of freedom in the manufacture of integrated circuits.

Abstract: A synchronous random access memory is arranged to be responsive directly to a system clock signal for operating synchronously with the associated microprocessor. The synchronous random access memory is further arranged to either write-in or read out data in a synchronous burst operation or synchronous wrap operation in addition to synchronous random access operations. The synchronous random access memory device may be fabricated as a dynamic storage device or as a static storage device.

Abstract: Two separate receivers (120,122) receive the input signal (128) and the clock signal (126). During the inactive state of the clock signal, the first receiver produces a low state output (130) and the second receiver produces a high state output (132). Both outputs feed combinational logic (124), which produces two outputs (142,144) both normally low. Upon transition of the clock signal, the output of only one of the receivers changes state to match the logic state of the input signal. The output of the other receiver maintains its logic state. Upon the change in the clock signal, only one of the combinational logic outputs changes state to a logical high state to indicate the state of the one input signal.

Abstract: A 1M.times.2 parity DRAM is salvaged from a defective 1M.times.4 parity DRAM having two or less unrepairable memory quadrants. Circuits are designed so "any" combination of 2 good quadrants can be accessed as a result of fuse blowing and steering logic which is controlled by the fuse signals.

Abstract: A semiconductor memory architecture, which includes a given number of discrete components, provides a memory module of increased capacity. The memory module includes a plurality of discrete data memory circuits each organized to provide an individual data string having a length that is an integer multiple of four bits. Each memory circuit has a different separate data lead. A row address strobe signal is applied to the memory circuits. A different column address strobe signal is applied to pairs of the memory circuits. Another discrete memory device includes plural dynamic cell arrays, each of the dynamic cell arrays having a terminal for receiving a row address strobe and a different separate data lead. Each of the dynamic cell arrays has a terminal for receiving a different column address strobe signal.

Abstract: A semiconductor memory architecture, which includes a given number of discrete components, provides a memory module of increased capacity. The memory module includes a plurality of discrete data memory circuits each organized to provide an individual data string having a length that is an integer multiple of four bits. The data memory circuits are arranged to provide a combined data string having a length equal to the sum of the individual data string lengths. Each data memory circuit includes a signal line connected to control transfer of individual data strings. A different data pin is associated with each bit of the combined data string to transfer a datum for output from the memory module. Each signal line is connected to a control pin to receive an external signal for initiating transfer of one of the individual strings from one of the data memory circuits. The module further includes an additional memory circuit having a plurality of additional signal lines and a plurality of additional data lines.