Abstract: Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

Abstract: Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

Abstract: Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

Abstract: A process for preparing a particle comprising a biological molecule typically a DNA plasmid, and a carrier polymer, typically poly-lactic acid (PLA), in which an organic solvent solution of the biological molecule and the carrier polymer in an organic solvent medium, nearly saturated with the biological molecule, is prepared, then this solution is contacted with an antisolvent substance, typically supercritical carbon dioxide to separate a particle comprising the biological molecule and the carrier polymer. High loadings of the biological molecule in the particle can be achieved.

Abstract: A metering and dispensing closure for a container wherein two rotatable disks rotate in conjunction with a stationary cap member to afford accurate measuring of a powder material and dispensing of it. The disks and the container cap afford a consistent measuring of the powder material, as well as provide a variety of drive members which can be utilized with the dispensing closure.

Abstract: A metering and dispensing closure for a container wherein two rotatable disks rotate in conjunction with a stationary cap member to afford accurate measuring of a powder material and dispensing of it. The disks and the container cap afford a consistent measuring of the powder material, as well as provide a variety of drive members which can be utilized with the dispensing closure.

Abstract: Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.