Abstract: An amplifier package includes a plurality of input leads, a plurality of transistor amplifiers having inputs respectively coupled to one of the plurality of input leads, and a quadrature hybrid coupler within the amplifier package and coupled between the plurality of input leads and the plurality of transistor amplifiers, wherein the quadrature hybrid coupler is configured to divide an input signal received from a first of the plurality of input leads between the plurality of transistor amplifiers.

Abstract: Systems and methods of sample preparation using dual ion beam trenching are described. In an example, an inside of a semiconductor package is non-destructively imaged to determine a region of interest (ROI). A mask is positioned over the semiconductor package, and a mask window is aligned with the ROI. A first ion beam and a second ion beam are swept, simultaneously or sequentially, along an edge of the mask window to trench the semiconductor package and to expose the ROI for analysis.

Abstract: Systems and methods of sample preparation using dual ion beam trenching are described. In an example, an inside of a semiconductor package is non-destructively imaged to determine a region of interest (ROI). A mask is positioned over the semiconductor package, and a mask window is aligned with the ROI. A first ion beam and a second ion beam are swept, simultaneously or sequentially, along an edge of the mask window to trench the semiconductor package and to expose the ROI for analysis.

Abstract: According to one embodiment, there is provided a mutual capacitance touchscreen comprising a first set of electrically conductive traces arranged in rows or columns and a second set of electrically conductive traces arranged in rows or columns arranged at right angles with respect to the rows or columns of the first set, where the first and second sets of traces are electrically insulated from and interdigitated respecting one another, and gaps between the first and second sets of traces form boundaries between the first and second sets of traces that undulate and that are not straight or linear. Other embodiments of a mutual capacitance touchscreen are also disclosed, such as “mini-diamond” sensor array patterns and sensor array patterns that may be manufactured at low cost.

Abstract: According to one embodiment, there is provided a mutual capacitance touchscreen comprising a first set of electrically conductive traces arranged in rows or columns and a second set of electrically conductive traces arranged in rows or columns arranged at right angles with respect to the rows or columns of the first set, where the first and second sets of traces are electrically insulated from and interdigitated respecting one another, and gaps between the first and second sets of traces form boundaries between the first and second sets of traces that undulate and that are not straight or linear. Other embodiments of a mutual capacitance touchscreen are also disclosed, such as “mini-diamond” sensor array patterns and sensor array patterns that may be manufactured at low cost.