Abstract: A vertical cylinder fitted into a 90 degree fitting that connects to a pipe organ air supply. Said pipe organ air supply is admitted into said 90 degree fitting thence to said cylinder ultimately urging a plunger to rise off of stop. Said plunger rises until it passes vents that allow said pipe organ air supply to exhaust to the atmosphere. Said plunger then descends. Said plunger continues to rise and fall in this fashion inducing rhythmic pulses of said pipe organ air supply until said pipe organ air supply is withdrawn. Said rhythmic pulses induce a change in pitch and amplitude of the pipe organ pipes when sounded thus providing a tremolo effect. Use of said plunger in this manner eliminates prior art usage of mechanical valves, fans and motors to induce a tremolo effect, and reduces the need for complex and expensive maintenance.

Abstract: A device (120) processes traffic in a network. The device (120) obtains information corresponding to an activity between a group of source devices and one or more services of destination devices, measures, for each of the group of source devices, a behavior of the source activity in terms of independence and uniformity of access to the one or more services, and determines, for each of the group of source devices, whether the source activity includes probing based on the measured behavior. The device (120) also determines, for each of the group of source devices, a similarity factor representing a similarity between the source activity of one of the group of source devices and another of the group of source devices, compares the similarity factors for each pair of source devices to a threshold, and groups source devices when the similar factor for those source devices are below the threshold.

Abstract: The invention is of a composition for treatment of non-healing and slow-healing wounds and ulcerations, and for treating and preventing peripheral neuropathy. The composition is primarily characterized by a combination of nitroglycerin and turmeric. Preferred embodiments comprise emollient cream, mineral oil, and zinc oxide.

Abstract: An environmental data collection system and method is provided having an internet link for providing an additional level of security for a remotely controlled data collection platform having a security alarm for protecting the platform and the environmental subject of the study. A novel lighter-than-air platform having a novel snorkel for detachably securing, mooring and providing buoyancy control is provided for the collection of data in the form of real time audio and video linked to the internet and subscribers. The novel snorkel is flexible and retractable into the novel airship to provide remote buoyancy control of the airship together with silently operating electrical motors for allowing the novel airship to be remotely controlled and moved at will to track and monitor wildlife and make environmental measurements necessary for the protection of the environment, wildlife and the operation of the novel airship.

Abstract: An environmental data collection system and method is provided having an internet link for providing an additional level of security for a remotely controlled data collection platform having a security alarm for protecting the platform and the environmental subject of the study. A novel lighter-than-air platform having a novel snorkel for detachably securing, mooring and providing buoyancy control is provided for the collection of data in the form of real time audio and video linked to the internet and subscribers. The novel snorkel is flexible and retractable into the novel airship to provide remote buoyancy control of the airship together with silently operating electrical motors for allowing the novel airship to be remotely controlled and moved at will to track and monitor wildlife and make environmental measurements necessary for the protection of the environment, wildlife and the operation of the novel airship.

Abstract: A method for applying an underfill and edge coating to a flip chip is described. The method includes the steps of adhering a bumped wafer to an expandable carrier substrate, sawing the wafer to form individual chips, stretching the carrier substrate in a bidirectional manner to form channels between each of the individual chips, applying an underfill material to the bumped surfaces of the chips and around the edges of the chips, cutting the underfill material in the channels between the chips and removing the individual, underfill coated chips from the carrier.

Abstract: A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then treated to form apertures therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.

Abstract: A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.

Abstract: The present invention relates to a process for forming a two-stage bump on a flip chip. The process employs an underfill material which can be formed to act as a mask for application of bumps formed from a first composition to the flip chip. A material having a different composition can then be applied to the bumps.

Abstract: A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then treated to form apertures therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.

Abstract: A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.

Abstract: Providing encapsulated electronic components on a circuit board by providing dams on a circuit board around areas on which respective electronic components will be mounted, mounting the respective electronic components within the dams on the circuit board, and printing encapsulating material through a stencil in order to provide deposits of encapsulating material over the electronic components and within the dams.