Patents by Inventor Kenneth C. Marston
Kenneth C. Marston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8421217Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.Type: GrantFiled: March 14, 2012Date of Patent: April 16, 2013Assignee: International Business Machines CorporationInventors: Jon A. Casey, John S. Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak, Kenneth C. Marston, Jennifer V. Muncy, Sylvain Ouimet, Eric Salvas
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Patent number: 8363404Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.Type: GrantFiled: December 14, 2010Date of Patent: January 29, 2013Assignee: International Business Machines CorporationInventors: John L. Colbert, Jason R. Eagle, Roger D. Hamilton, Kenneth C. Marston, Steven P. Ostrander
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Patent number: 8268389Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.Type: GrantFiled: January 8, 2010Date of Patent: September 18, 2012Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Paul W. Coteus, Michael A. Gaynes, Kenneth C. Marston, Steven P. Ostrander
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Publication number: 20120175766Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.Type: ApplicationFiled: March 14, 2012Publication date: July 12, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jon A. Casey, John S. Corbin, JR., David Danovitch, Isabelle Dépatie, Virendra R. Jadhav, Roger A. Liptak, Kenneth C. Marston, Jennifer V. Muncy, Sylvain Ouimet, Eric Salvas
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Patent number: 8214658Abstract: Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.Type: GrantFiled: August 20, 2008Date of Patent: July 3, 2012Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael S. Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcolm S. Ware, Roger D. Weekly
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Patent number: 8202765Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.Type: GrantFiled: January 22, 2009Date of Patent: June 19, 2012Assignee: International Business Machines CorporationInventors: Jon A. Casey, John S. Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak, Kenneth C. Marston, Jennifer V. Muncy, Sylvain Ouimet, Eric Salvas
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Publication number: 20120147563Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.Type: ApplicationFiled: December 14, 2010Publication date: June 14, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John L. Colbert, Jason R. Eagle, Roger D. Hamilton, Kenneth C. Marston, Steven P. Ostrander
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Publication number: 20120049341Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.Type: ApplicationFiled: November 7, 2011Publication date: March 1, 2012Applicant: International Business Machines CorporationInventors: Raschid Jose Bezama, Evan George Colgan, Michael Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei
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Patent number: 8115303Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.Type: GrantFiled: May 13, 2008Date of Patent: February 14, 2012Assignee: International Business Machines CorporationInventors: Raschid Jose Bezama, Evan George Colgan, Michael Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei
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Patent number: 7928562Abstract: An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.Type: GrantFiled: July 22, 2008Date of Patent: April 19, 2011Assignee: International Business Machines CorporationInventors: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz
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Patent number: 7917328Abstract: Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.Type: GrantFiled: August 20, 2008Date of Patent: March 29, 2011Assignee: International Business Machines CorporationInventors: Jon A. Casey, Michael S. Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcom S. Ware, Roger D. Weekly
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Patent number: 7834442Abstract: Disclosed herein are embodiments of electronic package incorporating a thermal interface material (e.g., a metal TIM) that is positioned between a lid and a chip on a substrate. The TIM has a predetermined (i.e., repeatable) minimum thickness and is further registered to the top surface of the chip (i.e., the TIM has an essentially symmetric shape and does not extend vertically along the sidewalls of the chip). Also, disclosed herein are embodiments of a method of forming such an electronic package that uses a hierarchical heating process that cures a lid sealant, thereby securing the lid to the substrate, and then reflows (i.e., melts and cools) the TIM, thereby adhering the TIM to both the chip and lid. This hierarchical heating process ensures that the TIM has the above-mentioned characteristics (i.e., a predetermined minimum thickness and registration to the top surface of the chip) and further provides robust process windows for high-yield, low-cost electronic package manufacturing.Type: GrantFiled: December 12, 2007Date of Patent: November 16, 2010Assignee: International Business Machines CorporationInventors: Bruce K Furman, Kenneth C Marston, Jiantao Zheng, Jeffrey A Zitz
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Publication number: 20100181665Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.Type: ApplicationFiled: January 22, 2009Publication date: July 22, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jon A. CASEY, John S. CORBIN, JR., David DANOVITCH, Isabelle DEPATIE, Virendra R. JADHAV, Roger A. LIPTAK, Kenneth C. MARSTON, Jennifer V. MUNCY, Sylvain OUIMET, Eric SALVAS
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Publication number: 20100049466Abstract: Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.Type: ApplicationFiled: August 20, 2008Publication date: February 25, 2010Applicant: International Business Machines CorporationInventors: Jon A. Casey, Michael S. Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcom S. Ware, Roger D. Weekly
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Publication number: 20100049995Abstract: Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.Type: ApplicationFiled: August 20, 2008Publication date: February 25, 2010Applicant: International Business Machines CorporationInventors: Jon A. Casey, Michael S. Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcolm S. Ware, Roger D. Weekly
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Publication number: 20100019377Abstract: An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.Type: ApplicationFiled: July 22, 2008Publication date: January 28, 2010Applicant: International Business Machines CorporationInventors: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz
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Publication number: 20090283902Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.Type: ApplicationFiled: May 13, 2008Publication date: November 19, 2009Inventors: Raschid Jose Bezama, Evan George Colgan, Michael Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei
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Publication number: 20090179322Abstract: Disclosed herein are embodiments of electronic package incorporating a thermal interface material (e.g., a metal TIM) that is positioned between a lid and a chip on a substrate. The TIM has a predetermined (i.e., repeatable) minimum thickness and is further registered to the top surface of the chip (i.e., the TIM has an essentially symmetric shape and does not extend vertically along the sidewalls of the chip). Also, disclosed herein are embodiments of a method of forming such an electronic package that uses a hierarchical heating process that cures a lid sealant, thereby securing the lid to the substrate, and then reflows (i.e., melts and cools) the TIM, thereby adhering the TIM to both the chip and lid. This hierarchical heating process ensures that the TIM has the above-mentioned characteristics (i.e., a predetermined minimum thickness and registration to the top surface of the chip) and further provides robust process windows for high-yield, low-cost electronic package manufacturing.Type: ApplicationFiled: December 12, 2007Publication date: July 16, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: BRUCE K FURMAN, Kenneth C Marston, Jiantao Zheng, Jeffrey A Zitz
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Patent number: 7239516Abstract: A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.Type: GrantFiled: September 10, 2004Date of Patent: July 3, 2007Assignee: International Business Machines CorporationInventors: David C. Long, Glenn G. Daves, David L. Edwards, Ronald L. Hering, Sushumna Iruvanti, Kenneth C. Marston, Jason S. Miller