Abstract: A method for interconnecting electrical system components. A leadframe (10) having leads (11) is encapsulated within a molding compound to form a first section (36) of the interconnect package (35). The first section (36) optionally includes channels (54). A leadframe (20) having leads (22, 23) is encapsulated within a molding compound to form a second section (37) of the interconnect package (35). The first and second sections (36 and 37, respectively) are coupled together with an adhesive material (43). An end (44) is removed from the interconnect package (35) forming an edge (50). A bare semiconductor chip (51) is coupled to the edge (50).

Abstract: An interconnect package (35) for interconnecting electrical system components. A first leadframe (10) having leads (11) is encapsulated within a molding compound forming a first section (36) of the interconnect package (35). The first section (36) optionally includes channels (54). A second leadframe (20) having leads (22, 23) is encapsulated within a molding compound forming a second section (37) of the interconnect package (35). The first and second sections (36 and 37, respectively) are coupled together with an adhesive material (43). An end (44) is removed from the interconnect package (35) forming an edge (50). A semiconductor chip (51) is coupled to the edge (50).

Abstract: A non-ferrous powder formed of a prealloy of copper, tin and zinc, the present article of manufacture exhibits sufficient green strength to allow direct compacting and sintering of useful articles from the "as atomized" form. The present prealloy powder is preferably air atomized from an alloy of copper, tin and zinc, the respective nominal weight percents of the components in the resulting prealloy powder being 89%, 9% and 2%. The present prealloy powder is preferably lubricated with conventional dry organic lubricants and can optionally be blended with carbonyl iron, carbonyl iron nominally comprising 1.0% to 3.0% by weight of the powder.