Patents by Inventor Kenneth Costello
Kenneth Costello has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11810750Abstract: A rotatable stage for an analytical apparatus. The rotatable stage has a stator, a heat exchanger in thermal connection with the stator, a rotor and a bearing located between the stator and the rotor. The bearing provides a thermal connection between the stator and rotor.Type: GrantFiled: February 25, 2019Date of Patent: November 7, 2023Assignee: Quorum Technologies Ltd.Inventors: Robert Morrison, Kenneth Costello
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Publication number: 20230282670Abstract: An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.Type: ApplicationFiled: March 3, 2023Publication date: September 7, 2023Inventors: Kenneth Costello, Kevin Roderick, Verle Aebi
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Patent number: 11621289Abstract: An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.Type: GrantFiled: May 22, 2020Date of Patent: April 4, 2023Assignee: EOTech, LLCInventors: Kenneth Costello, Kevin Roderick, Verle Aebi
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Publication number: 20210366972Abstract: An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.Type: ApplicationFiled: May 22, 2020Publication date: November 25, 2021Inventors: Kenneth Costello, Kevin Roderick, Verle Aebi
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Publication number: 20200411276Abstract: A rotatable stage for an analytical apparatus. The rotatable stage has a stator, a heat exchanger in thermal connection with the stator, a rotor and a bearing located between the stator and the rotor. The bearing provides a thermal connection between the stator and rotor.Type: ApplicationFiled: February 25, 2019Publication date: December 31, 2020Inventors: Robert Morrison, Kenneth COSTELLO
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Patent number: 10692683Abstract: A novel photocathode employing a conduction band barrier is described. Incorporation of a barrier optimizes a trade-off between photoelectron transport efficiency and photoelectron escape probability. The barrier energy is designed to achieve a net increase in photocathode sensitivity over a specific operational temperature range.Type: GrantFiled: September 12, 2017Date of Patent: June 23, 2020Assignee: INTEVAC, INC.Inventors: Kenneth A. Costello, Verle W. Aebi, Michael Jurkovic, Xi Zeng
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Publication number: 20190080875Abstract: A novel photocathode employing a conduction band barrier is described. Incorporation of a barrier optimizes a trade-off between photoelectron transport efficiency and photoelectron escape probability. The barrier energy is designed to achieve a net increase in photocathode sensitivity over a specific operational temperature range.Type: ApplicationFiled: September 12, 2017Publication date: March 14, 2019Inventors: Kenneth A. Costello, Verle W. Aebi, Michael Jurkovic, Xi Zeng
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Patent number: 9734977Abstract: An image intensifier and a method of fabrication are disclosed. The image intensifier contains a photocathode assembly (120) including a vacuum window to generate photoelectrons in response to light, a vacuum package (110) and an anode assembly (130) to receive the photoelectrons. The anode assembly is mounted to the vacuum package via a compliant, springy, support structure (160). The anode additionally includes one or more insulating spacers (140) on the surface facing the photocathode so as to precisely index the position of the anode assembly with respect to the photocathode surface. The photocathode and vacuum window assembly is pressed into the vacuum package to generate a sealed leak tight vacuum envelope. During the photocathode assembly to vacuum package assembly pressing operation, the inner surface of the photocathode assembly contacts the insulating spacer/spacers of the anode assembly, thereby compressing the compliant support structure.Type: GrantFiled: July 16, 2015Date of Patent: August 15, 2017Assignee: INTEVAC, INC.Inventors: Kenneth Costello, Kevin Roderick
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Publication number: 20170018391Abstract: An image intensifier and a method of fabrication are disclosed. The image intensifier contains a photocathode assembly (120) including a vacuum window to generate photoelectrons in response to light, a vacuum package (110) and an anode assembly (130) to receive the photoelectrons. The anode assembly is mounted to the vacuum package via a compliant, springy, support structure (160). The anode additionally includes one or more insulating spacers (140) on the surface facing the photocathode so as to precisely index the position of the anode assembly with respect to the photocathode surface. The photocathode and vacuum window assembly is pressed into the vacuum package to generate a sealed leak tight vacuum envelope. During the photocathode assembly to vacuum package assembly pressing operation, the inner surface of the photocathode assembly contacts the insulating spacer/spacers of the anode assembly, thereby compressing the compliant support structure.Type: ApplicationFiled: July 16, 2015Publication date: January 19, 2017Inventors: Kenneth Costello, Kevin Roderick
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Patent number: 8975668Abstract: A structure and method of manufacture is disclosed for a backside thinned imager that incorporates a conformal, Al2O3, low thermal budget, surface passivation. This passivation approach facilitates fabrication of backside thinned, backside illuminated, silicon image sensors with thick silicon absorber layer patterned with vertical trenches that are formed by etching the exposed back surface of a backside-thinned image sensor to control photo-carrier diffusion and optical crosstalk. A method of manufacture employing conformal, Al2O3, surface passivation approach is shown to provide high quantum efficiency and low dark current while meeting the thermal budget constraints of a finished standard foundry-produced CMOS imager.Type: GrantFiled: September 14, 2012Date of Patent: March 10, 2015Assignee: Intevac, Inc.Inventors: Kenneth A. Costello, Edward Yin, Michael Wayne Pelczynski, Verle W. Aebi
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Patent number: 8698925Abstract: An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.Type: GrantFiled: April 21, 2010Date of Patent: April 15, 2014Assignee: Intevac, Inc.Inventors: Kenneth A. Costello, Kevin J. Roderick, Edward Yin, Douglas Fowler
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Publication number: 20130105928Abstract: A structure and method of manufacture is disclosed for a backside thinned imager that incorporates a conformal, Al2O3, low thermal budget, surface passivation. This passivation approach facilitates fabrication of backside thinned, backside illuminated, silicon image sensors with thick silicon absorber layer patterned with vertical trenches that are formed by etching the exposed back surface of a backside-thinned image sensor to control photo-carrier diffusion and optical crosstalk. A method of manufacture employing conformal, Al2O3, surface passivation approach is shown to provide high quantum efficiency and low dark current while meeting the thermal budget constraints of a finished standard foundry-produced CMOS imager.Type: ApplicationFiled: September 14, 2012Publication date: May 2, 2013Applicant: INTEVAC, INC.Inventors: Kenneth A. COSTELLO, Edward YIN, Michael Wayne PELCZYNSKI, Verle W. AEBI
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Publication number: 20110261239Abstract: An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.Type: ApplicationFiled: April 21, 2010Publication date: October 27, 2011Applicant: INTEVAC, INC.Inventors: Kenneth A. COSTELLO, Kevin J. Roderick, Edward Yin, Douglas Fowler
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Patent number: 7608533Abstract: There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.Type: GrantFiled: January 3, 2006Date of Patent: October 27, 2009Assignee: Intevac, Inc.Inventors: Kenneth A Costello, Kevin James Roderick
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Patent number: 7607560Abstract: Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.Type: GrantFiled: July 28, 2005Date of Patent: October 27, 2009Assignee: Intevac, Inc.Inventor: Kenneth A Costello
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Patent number: 7531826Abstract: A novel photocathode employing a rectifying junction is described that permits color imaging extending applications for photocathodes in a variety of instruments and night vision devices.Type: GrantFiled: June 1, 2005Date of Patent: May 12, 2009Assignee: Intevac, Inc.Inventors: Kenneth A Costello, Verle W. Aebi
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Patent number: 7479686Abstract: Backthinning in an area selective manner is applied to CMOS imaging sensors 12 for use in electron bombarded active pixel array devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels of an active pixel array providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.Type: GrantFiled: November 30, 2005Date of Patent: January 20, 2009Assignee: Intevac, Inc.Inventors: Kenneth A Costello, Kevin P. Fairbairn, David W. Brown, Yun Chung, Patricia Gober, Edward Yin
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Patent number: 7325715Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.Type: GrantFiled: June 29, 2004Date of Patent: February 5, 2008Assignee: Interac, Inc.Inventor: Kenneth A. Costello
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Publication number: 20070034987Abstract: A novel photocathode employing a rectifying junction is described that permits color imaging extending applications for photocathodes in various instruments and night vision devices.Type: ApplicationFiled: June 1, 2005Publication date: February 15, 2007Inventors: Kenneth Costello, Verle Aebi
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Publication number: 20060138322Abstract: Backthinning in an area selective manner is applied to CMOS imaging sensors 12 for use in electron bombarded active pixel array devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels of an active pixel array providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.Type: ApplicationFiled: November 30, 2005Publication date: June 29, 2006Inventors: Kenneth Costello, Kevin Fairbairn, David Brown, Yun Chung, Patricia Gober, Edward Yin