Abstract: A sorbent article formed from a resin bonded sorbent composition and having a first volume of the resin bonded sorbent composition used to form the sorbent article and a first surface area equal to a first total area of exposed surfaces of the first volume, the sorbent article including a base having an exposed surface area including only flat surfaces, convex surfaces or combinations thereof, at least one of: a protrusion extending from the exposed surface area of the base; and/or, a partial bore extending into the exposed surface area of the base, a capacity ratio of the first volume to a second volume greater than or equal to 0.5 and an uptake rate ratio greater than or equal to 2.0, wherein the uptake rate ratio is calculated according to the equation: ? = SA 1 / V 1 SA 2 / V 2 , wherein: ? is the uptake rate ratio, SA1 is the first surface area, V1 is the first volume, SA2 is a second surface area and V2 is the second volume.

Abstract: A ceramic substrate is provided with filled via holes for electrical or thermal feedthrough to or from an electronic device, each via hole having at least one dimension from about 4 to about 50 mils. The via holes are filled with copper, silver or gold for high conductivity and the filling is without visible voids at a magnification of 1000 diameters. The filling is preferably hermetic and is achieved by first electrodepositing metal into the holes and extending therefrom as dumbbell shaped plugs and then heating the substrate to the melting point of the metal so that metal from the dumbbell ends enters the connecting portion within the via hole to seal any aperture therein.

Abstract: A ceramic substrate is provided with filled via holes for electrical or thermal feedthrough to or from an electronic device, each via hole having at least one dimension from about 4 to about 50 mils. The via holes are filled with copper, silver or gold for high conductivity and the filling is without visible voids at a magnification of 1000 diameters. The filling is preferably hermetic and is achieved by first electrodepositing metal into the holes and extending therefrom as dumbbell shaped plugs and then heating the substrate to the melting point of the metal so that metal from the dumbbell ends enters the connecting portion within the via hole to seal any aperture therein.