Abstract: A heater assembly includes a heating member, a mounting member that mounts the heating member to a wall of an external component, and an insulator disposed between the heating member and the wall. The insulator electrically insulates the heating member from the wall and blocks a ground path from the heating member to the wall of the external component.

Abstract: A heater assembly includes a heating member, a mounting member that mounts the heating member to a wall of an external component, and an insulator disposed between the heating member and the wall. The insulator electrically insulates the heating member from the wall and blocks a ground path from the heating member to the wall of the external component.

Abstract: A combination plumb and level tool has an elongate body with separated longitudinal arm members that have spaced apart, proximal ends fixed to the body and extend therefrom to respective separate distal free ends. The distal ends form longitudinally extending interior surfaces disposed in facing opposition located between their respective fixed and free ends. The arms and the body between them have a generally U-shaped cross section that forms an open trough from the free ends to a base contact surface between the proximal fixed ends. At least one of the arms has longitudinal extending first contact surface portion disposed on its interior surface. The first contact surface portion faces an opposing second contact surface portion of the facing arm interior surface. An elastic member cooperating with the first arm and the body biases the first arm inward, toward the second contact surface portion on the other of the arms.

Abstract: A semiconductor device test head docking interface system includes a test head plate juxtaposed to a test head. The tester plate includes pairs of outwardly facing spaced vacuum cups and pairs of spaced guiding and locking pins between the cups. A handler plate includes pairs of vacuum cup receiving surfaces spaced to receive the vacuum cups upon a docking of the plates, and pairs of receiving sockets spaced to receive the guiding and locking pins upon a docking of the plates. Rotary actuators are mounted on the tester plate for rotating each of the guiding and locking pins in a respective one of the receiving sockets, such that engagement and a pulling vacuum in the vacuum cups against the vacuum cup receiving surfaces and rotation of the guiding and locking pins, effects docking of the tester plate and handler plate. A Z-axis adjustment is provided in each actuator.

Abstract: A cassette loading mechanism for semiconductor processing equipment reduces the possibility of repetitive stress injury that may occur as a result of repeatedly loading and unloading a cassette of substrates by eliminating manual cassette rotation. The loader receives a cassette and, by compound translational movement, rotates the cassette about 90.degree. from a horizontal loading position, in which the substrates contained therein are positioned in a vertical orientation, to a position in which the substrates contained therein are positioned in a horizontal orientation, such that the cassette is aligned to the other components of the substrate handling system for substrate transfer. The cassette motions are interlocked with the cassette clamping mechanism and the cassette loader door and a cassette shuttle by pneumatic or electronic logic.