Abstract: A soldering iron system with automatic variable temperature control includes a hand piece or robot arm including a soldering cartridge having a soldering tip, a heating coil and a temperature sensor or impedance measuring device for sensing a temperature or measuring an impedance of the soldering tip; a variable power supply for delivering variable power to the heating coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip and providing a control signal to control the variable power supply to deliver a suitable power to the heating coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.

Abstract: A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

Abstract: A three-dimensional printer including a print head for extruding a print material and a build platform for receipt the print material, the print head and the build platform each having a motion sensor for generating a position signal to a controller which compares the actual position of the print head and the build platform with a desired position of the print head and the build platform for generating an error signal to x-y axis and z-y axis translators to minimize relative motion between the print head and the build platform and unwanted positional error in an x-y printing plane.

Abstract: A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period.

Abstract: A gyroscope having photonic crystals for sensing rotation uses the Sagnac effect to determine angular motion. The gyroscope comprises a photonic crystal capable of guiding counter-propagating light beams in a closed path. A light source, coupling, and detection apparatus permits detection of phase changes between the counter-propagating beams, thereby permitting measurement of angular rotation. The photonic crystal comprises a periodic structure of pillars and voids which creates a photonic bandgap waveguide within which light waves in the proper wavelength range propagate with low loss.

Abstract: A gyroscope having photonic crystals for sensing rotation uses the Sagnac effect to determine angular motion. The gyroscope comprises a photonic crystal capable of guiding counter-propagating light beams in a closed path. A light source, coupling, and detection apparatus permits detection of phase changes between the counter-propagating beams, thereby permitting measurement of angular rotation. The photonic crystal comprises a periodic structure of pillars and voids which creates a photonic bandgap waveguide within which light waves in the proper wavelength range propagate with low loss.

Abstract: A gyroscope having photonic crystals for sensing rotation uses the Sagnac effect to determine angular motion. The gyroscope comprises a photonic crystal capable of guiding counter-propagating light beams in a closed path. A light source, coupling, and detection apparatus permits detection of phase changes between the counter-propagating beams, thereby permitting measurement of angular rotation. The photonic crystal comprises a periodic structure of pillars and voids which creates a photonic bandgap waveguide within which light waves in the proper wavelength range propagate with low loss.

Abstract: A gyroscope having photonic crystals for sensing rotation uses the Sagnac effect to determine angular motion. The gyroscope comprises a photonic crystal capable of guiding counter-propagating light beams in a closed path. A light source, coupling, and detection apparatus permits detection of phase changes between the counter-propagating beams, thereby permitting measurement of angular rotation. The photonic crystal comprises a periodic structure of pillars and voids which creates a photonic bandgap waveguide within which light waves in the proper wavelength range propagate with low loss.

Abstract: A cell in one example comprises an alkali metal and a coating of parylene on an interior surface of the cell. In one implementation, the alkali metal may be an optically pumped gaseous phase of an alkali metal. The parylene coating minimizes interaction of the excited state of the alkali metal, increases lifetime of the excited state, and minimizes interaction of nuclear spin states with the cell walls.