Abstract: A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.

Abstract: A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.

Abstract: A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Abstract: A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.

Abstract: A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.

Abstract: An apparatus with an ultra low power architecture is described herein. The apparatus includes a first power supply rail, wherein a plurality of subsystems are to be powered by the first power supply rail. The apparatus also includes a second power supply rail, wherein a plurality of autonomous subsystems are to be powered by the power supply rail, wherein the second power supply rail is to be always on, always available, and low power.

Abstract: An integrated circuit such as a SoC may indicate the critical battery status without powering-on a substantial portion including the host processing cores. The SoC may include a microcontroller, which may cause the critical battery status data to be stored in a static memory and the display unit may retrieve such data from the static memory to display a visual symbol on the screen. The other portions of the SoC such as the dynamic memory, system agent, media processors, and memory controller hubs may be powered-down while the critical battery status is displayed in the visual form on the screen.

Abstract: A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Abstract: A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Abstract: A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Abstract: An integrated circuit such as a SoC may indicate the critical battery status without powering-on a substantial portion including the host processing cores. The SoC may include a microcontroller, which may cause the critical battery status data to be stored in a static memory and the display unit may retrieve such data from the static memory to display a visual symbol on the screen. The other portions of the SoC such as the dynamic memory, system agent, media processors, and memory controller hubs may be powered-down while the critical battery status is displayed in the visual form on the screen.

Abstract: Technologies for implementing a secure boot using multiple firmware sources are described. One or more fuses of a processing device can be configured. Based on such configuration, one or more keys can be generated. Based on the configuration of the various fuses, an operation of a firmware device can be initiated. Using the generated key(s), a protected section of the firmware device can be accessed.

Abstract: An integrated circuit such as a SoC may indicate the critical battery status without powering-on a substantial portion including the host processing cores. The SoC may include a microcontroller, which may cause the critical battery status data to be stored in a static memory and the display unit may retrieve such data from the static memory to display a visual symbol on the screen. The other portions of the SoC such as the dynamic memory, system agent, media processors, and memory controller hubs may be powered-down while the critical battery status is displayed in the visual form on the screen.

Abstract: A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Abstract: An apparatus with an ultra low power architecture is described herein. The apparatus includes a first power supply rail, wherein a plurality of subsystems are to be powered by the first power supply rail. The apparatus also includes a second power supply rail, wherein a plurality of autonomous subsystems are to be powered by the power supply rail, wherein the second power supply rail is to be always on, always available, and low power.

Abstract: Technologies for implementing a secure boot using multiple firmware sources are described. One or more fuses of a processing device can be configured. Based on such configuration, one or more keys can be generated. Based on the configuration of the various fuses, an operation of a firmware device can be initiated. Using the generated key(s), a protected section of the firmware device can be accessed.

Abstract: An integrated circuit such as a SoC may indicate the critical battery status without powering-on a substantial portion including the host processing cores. The SoC may include a microcontroller, which may cause the critical battery status data to be stored in a static memory and the display unit may retrieve such data from the static memory to display a visual symbol on the screen. The other portions of the SoC such as the dynamic memory, system agent, media processors, and memory controller hubs may be powered-down while the critical battery status is displayed in the visual form on the screen.

Abstract: A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Abstract: A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Abstract: In some embodiments, a power up (or power mode) interface is provided whereby a chip's power up signals are encoded into multiple states to provide more functions than the number of signals used to define the states.