Patents by Inventor Kenneth Daryl Wong

Kenneth Daryl Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of interconnecting a circuit board to a substrate
    Patent number: 6954987
    Abstract: A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: October 18, 2005
    Assignee: Powerwave Technologies, Inc.
    Inventors: Kenneth Daryl Wong, Sean L. Bell
  • Circuit board assembly employing solder vent hole
    Publication number: 20040231884
    Abstract: A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.
    Type: Application
    Filed: May 19, 2004
    Publication date: November 25, 2004
    Inventors: Kenneth Daryl Wong, Sean L. Bell