Patents by Inventor Kenneth Diest

Kenneth Diest has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7732902
    Abstract: A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: June 8, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James C. McKinnell, Chien-Hua Chen, Kenneth Diest, Kenneth M. Kramer, Daniel A. Kearl
  • Patent number: 7693363
    Abstract: The invention is a system and method for performing all-optical modulation. A semiconductor layer having a defined thickness has an insulator adjacent one surface of the semiconductor. Conductive layers are provided adjacent the semiconductor layer and the insulator. A photodetector is provided to generate an electric field across the conductive layers in response to an input optical gate signal. An input optical signal is modulated by interaction with a plasmon wave generated at the semiconductor/conductive layer interface. By defining the thickness of the semiconductor layer, a desired wavelength of light supports the plasmon waves. Operation of the all-optical modulator requires the provision of an input optical signal of a desired wavelength and the provision of a gate optical signal. An output optical signal is recovered and can be used to store, display or transmit information, for example over a fiber optic communication system, such as a telecommunication system.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: April 6, 2010
    Assignee: California Institute of Technology
    Inventors: Jennifer A. Dionne, Kenneth A. Diest, Luke Sweatlock, Harry A. Atwater
  • Publication number: 20100002979
    Abstract: A slot waveguide utilized as a color-selecting element. The slot waveguide includes a first layer of plasmon supporting material, the first layer being optically opaque and having an input slit extending through the first layer; a second layer of plasmon supporting material facing the first layer and separated from the first layer by a first distance in a first direction, the second layer being optically opaque and having an output slit extending through the second layer and separated from the input slit by a second distance extending along a second direction differing from first direction; a dielectric layer interposed between the first layer and the second layer, the dielectric layer having a real or complex refractive index; and a power source electrically coupled to the first layer and the second layer to apply an electrical signal for modulation of the real or complex refractive index of the dielectric layer.
    Type: Application
    Filed: June 25, 2008
    Publication date: January 7, 2010
    Inventors: Kenneth A. Diest, Jennifer A. Dionne, Harry A. Atwater, Henri Lezec
  • Publication number: 20090273820
    Abstract: The invention is a system and method for performing all-optical modulation. A semiconductor layer having a defined thickness has an insulator adjacent one surface of the semiconductor. Conductive layers are provided adjacent the semiconductor layer and the insulator. A photodetector is provided to generate an electric field across the conductive layers in response to an input optical gate signal. An input optical signal is modulated by interaction with a plasmon wave generated at the semiconductor/conductive layer interface. By defining the thickness of the semiconductor layer, a desired wavelength of light supports the plasmon waves. Operation of the all-optical modulator requires the provision of an input optical signal of a desired wavelength and the provision of a gate optical signal. An output optical signal is recovered and can be used to store, display or transmit information, for example over a fiber optic communication system, such as a telecommunication system.
    Type: Application
    Filed: March 24, 2009
    Publication date: November 5, 2009
    Inventors: Jennifer A. Dionne, Kenneth A. Diest, Luke Sweatlock, Harry A. Atwater
  • Patent number: 7211881
    Abstract: A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially maintained around the desiccant.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: May 1, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James McKinnell, Kenneth Diest, Chien-Hua Chen
  • Publication number: 20070052108
    Abstract: A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
    Type: Application
    Filed: September 5, 2006
    Publication date: March 8, 2007
    Inventors: James McKinnell, Chien-Hua Chen, Kenneth Diest, Kenneth Kramer, Daniel Kearl
  • Patent number: 7147908
    Abstract: A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: December 12, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James C. McKinnell, Chien-Hua Chen, Kenneth Diest, Kenneth M. Kramer, Daniel A. Kearl
  • Publication number: 20060083896
    Abstract: A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
    Type: Application
    Filed: October 13, 2004
    Publication date: April 20, 2006
    Inventors: James McKinnell, Chien-Hua Chen, Kenneth Diest, Kenneth Kramer, Daniel Kearl
  • Publication number: 20050212115
    Abstract: A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially maintained around the desiccant.
    Type: Application
    Filed: March 24, 2004
    Publication date: September 29, 2005
    Inventors: James McKinnell, Kenneth Diest, Chien-Hua Chen
  • Patent number: 6890067
    Abstract: A fluid ejection assembly includes at least one inner layer having a fluid passage defined therein, and first and second outer layers positioned on opposite sides of the at least one inner layer. The first and second outer layers each have a side adjacent the at least one inner layer and include drop ejecting elements formed on the side and fluid pathways communicated with the drop ejecting elements. The fluid pathways of the first and second outer layers communicate with the fluid passage of the at least one inner layer, and the at least one inner layer and the fluid pathways of the first outer layer form a first row of nozzles, and the at least one inner layer and the fluid pathways of the second outer layer form a second row of nozzles.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: May 10, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott Hock, Hector Lebron, Paul Crivelli, Kenneth Diest
  • Publication number: 20050001886
    Abstract: A fluid ejection assembly includes at least one inner layer having a fluid passage defined therein, and first and second outer layers positioned on opposite sides of the at least one inner layer. The first and second outer layers each have a side adjacent the at least one inner layer and include drop ejecting elements formed on the side and fluid pathways communicated with the drop ejecting elements. The fluid pathways of the first and second outer layers communicate with the fluid passage of the at least one inner layer, and the at least one inner layer and the fluid pathways of the first outer layer form a first row of nozzles, and the at least one inner layer and the fluid pathways of the second outer layer form a second row of nozzles.
    Type: Application
    Filed: July 3, 2003
    Publication date: January 6, 2005
    Inventors: Scott Hock, Hector Lebron, Paul Crivelli, Kenneth Diest