Patents by Inventor Kenneth E. Cook

Kenneth E. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5577561
    Abstract: This invention relates to an apparatus and method for penetrating a titanium walled enclosure to dispense a fire fighting agent within the enclosure. A penetrating device is attached to the forward end of a rotatable barrel, providing for penetration of the titanium wall of an enclosure and insertion of the forward end of the barrel through the titanium wall. The rotatable barrel is mechanically coupled to a controllable actuating device, such as a motor. The actuating device is used to rotate the barrel, thereby driving the penetrating device to penetrate into the enclosure, allowing insertion of the penetrating device and the forward end of the rotatable barrel into the enclosure. Fire fighting fluid is dispensed into the enclosure through a fluid channel in the barrel.
    Type: Grant
    Filed: August 15, 1995
    Date of Patent: November 26, 1996
    Assignee: Oceaneering International, Inc.
    Inventor: Kenneth E. Cook
  • Patent number: 5507038
    Abstract: A heat seal connector (100) includes a flexible substrate (105), interconnects (110) disposed thereon, and a parting agent (115) contiguous with the flexible substrate (105) for preventing the heat seal connector (100) from adhering to a heating platen (505) applied thereto, wherein the heating platen (505) does not include a parting agent for preventing the heat seal connector (100) from adhering to the healing platen (505). The heat seal connector (100) is bonded to first and second electronic circuits (415, 420) during application of the heating platen (505) such that the interconnects (110) electrically couple conductive pads (417) formed on the first electronic circuit (415) to corresponding conductive pads (425) formed on the second electronic circuit (420).
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: April 9, 1996
    Assignee: Motorola, Inc.
    Inventors: Kenneth E. Cook, Jonathan Carr, John P. Cheraso
  • Patent number: 5329870
    Abstract: A watercraft employs three or more supercavitating hydrofoils. The elements that connect the hydrofoils to the hull may flex to thus raise or lower the hydrofoils relative to the hull. The relative motion between the hydrofoils and the hull is dampened by shock absorbers or the like. A control system operated by the pilot may apply forces tending to raise or lower the hydrofoils relative to the hull. The stern hydrofoil is mounted on a support that also carries a power driven propeller and a rudder.
    Type: Grant
    Filed: September 9, 1991
    Date of Patent: July 19, 1994
    Inventor: Kenneth E. Cook
  • Patent number: 5320561
    Abstract: A connector (40) for insertion into a portable electronic device (30) provides testing, programming and power thereto. The portable electronic device (30) has a chassis (32) housed therein and further includes a battery cavity (35) with battery contacts (36) therein. The connector (40) has a distal end for contacting the chassis (32) through an access port (34) in the battery cavity (35). A proximal end of the connector (40) is adapted for connection to a cable. The connector (40) has a substrate (50) attached to a printed wire board (41), wherein the printed wire board (41) further comprises a first plurality of conductors (52) thereon for receiving data signals from the cable, and a second plurality of conductors (42) thereon for receiving power signals from the cable.
    Type: Grant
    Filed: June 19, 1992
    Date of Patent: June 14, 1994
    Assignee: Motorola, Inc.
    Inventors: Kenneth E. Cook, Arthur L. A. Baker, Kenneth R. Warren, Paul M. Bricketto, Allen D. Hertz
  • Patent number: 5159171
    Abstract: A method for solder deposition by the use of a laser (24), comprises the steps of applying a predetermined thickness of solder (6) to a substrate (2) including over a printed circuitry pattern (4) on the substrate, laser printing (24) to a reflow temperature the solder on the printed circuitry pattern, leaving an un-reflowed portion (9) and then removing (26) the un-reflowed portion of the substrate, leaving solidified solder (7) on the printed circuitry pattern of the substrate. Additionally, if desired, a part (12) having solder pads (14) can be placed on the solder (7) after tack media (13) is placed on the solder. Then the part (12) and substrate can be reflowed in an oven (34).
    Type: Grant
    Filed: September 3, 1991
    Date of Patent: October 27, 1992
    Assignee: Motorola, Inc.
    Inventors: Kenneth E. Cook, Allen D. Hertz, David A. Tribbey, John P. Cheraso