Abstract: An optical metrology device uses a multi-wavelength beam of light that has azimuthally varying polarization states and/or phase states, referred to as a vortex beam. The metrology device focuses the vortex beam on a sample under test over a large range of angles of incidence. The metrology device may detect an image of the vortex beam reflected from the sample and measure the polarization state of the return light as function of the angle of incidence and the azimuth angle, which may be further measured at a plurality of different wavelengths. The vortex beam includes azimuthally varying polarization states, thereby enabling measurement of all desired polarization states without requiring the use of moving optical components. The polarization state information detected over multiple angles of incidence and wavelengths provides data with which an accurate determination of one or more characteristics of a sample may be determined.

Abstract: An optical metrology device uses a multi-wavelength beam of light that has azimuthally varying polarization states and/or phase states, referred to as a vortex beam. The metrology device focuses the vortex beam on a sample under test over a large range of angles of incidence. The metrology device may detect an image of the vortex beam reflected from the sample and measure the polarization state of the return light as function of the angle of incidence and the azimuth angle, which may be further measured at a plurality of different wavelengths. The vortex beam includes azimuthally varying polarization states, thereby enabling measurement of all desired polarization states without requiring the use of moving optical components. The polarization state information detected over multiple angles of incidence and wavelengths provides data with which an accurate determination of one or more characteristics of a sample may be determined.

Abstract: A damper for a semiconductor metrology or inspection system includes a pair of parallel plates with a fluid with a variable viscosity retained between plates. At least one wire is disposed between the plates, which may include one or more sets of lands and grooves. In some implementations, both plates include intermeshed lands and grooves. A controller is configured to provide a current to the at least one wire in order to adjust an electromagnetic field or a current through the fluid. The fluid may be a magnetorheological fluid or an electrorheological fluid in which the viscosity of the fluid is variable based on the electromagnetic field or current through the fluid. The controller varies the current applied to the wire to adjust the viscosity of the fluid to alter the damping of the semiconductor metrology or inspection system based on movement of the stage.

Abstract: A damper for a semiconductor metrology or inspection system includes a pair of parallel plates with a fluid with a variable viscosity retained between plates. At least one wire is disposed between the plates, which may include one or more sets of lands and grooves. In some implementations, both plates include intermeshed lands and grooves. A controller is configured to provide a current to the at least one wire in order to adjust an electromagnetic field or a current through the fluid. The fluid may be a magnetorheological fluid or an electrorheological fluid in which the viscosity of the fluid is variable based on the electromagnetic field or current through the fluid. The controller varies the current applied to the wire to adjust the viscosity of the fluid to alter the damping of the semiconductor metrology or inspection system based on movement of the stage.

Abstract: A pipe joint for large diameter steel pipe in the range of 54 to 140 inches or greater, reinforced plastic-mortor pipe larger than 42 inches, ductile-iron pipe larger than 30 inches, and glass reinforced plastic pipe larger than 20 inches which includes a spigot having an annular groove formed between two spaced ribs for receiving an annular gasket which extends outwardly beyond the ribs. Under usual circumstances, when the spigot is positioned within the bell of the adjacent pipe, the gasket engages the interior surface of the bell as well as the surfaces of the annular groove in the spigot. However, during assembly in those instances where the bell and/or the spigot are out of round, the spigot can be forced toward the bell so that the gasket engages the inner surface thereof around its entire periphery and can be held temporarily thereagainst by means of jacks and braces.