Patents by Inventor Kenneth G. Maish

Kenneth G. Maish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Using a thermal barrier to provide a hermetic seal surface on aluminum nitride substrate electronic packages
    Patent number: 5770890
    Abstract: A hermetically sealed microelectronic package that uses a thermal barrier or interposer between a cover and an aluminum nitride substrate. A solder interface is disposed on an aluminum nitride substrate, and the thermal barrier is disposed on the solder interface. The cover is attached to the solder interface using a solder seal that solders the cover to the interposer to produce a hermetically sealed package. The thermal barrier or interposer permits low cost, low temperature soldering of metal covers to metallized aluminum nitride substrate and is compatible with volume production processing.
    Type: Grant
    Filed: February 25, 1997
    Date of Patent: June 23, 1998
    Assignee: Raytheon Company
    Inventors: Gary A. Dreyer, Alan L. Kovacs, Kenneth G. Maish