Abstract: A magnet assembly in a magnetic resonance apparatus includes a cryostat and a superconducting main field magnet coil system arranged therein for generating a magnetic field in the direction of a z-axis in a working volume. The magnet assembly includes a shim device arranged inside the cryostat for adjusting the spatial variation or homogeneity of the magnetic field generated in the working volume by the magnet coil system. The shim device comprises at least one closed superconducting shim conductor path having an HTS layer. The HTS layer forms a surface that is geometrically developable such that unwrapping onto a plane changes the geodesic distance between any two points on the surface formed by the HTS layer by no more than 10%. The inner and/or outer contour of the geometrical development of the HTS layer describes a non-convex curve.

Abstract: A layer wound magnet coil includes a central coil region and end coil regions adjoining the central coil region along an axial line of symmetry. The central coil region includes layers of coil windings of an anisotropic material. The end coil regions include layers of coil windings of the anisotropic superconducting material interspersed with layers of non-superconducting material.

Abstract: A magnet assembly in a magnetic resonance apparatus includes a cryostat and a superconducting main field magnet coil system arranged therein for generating a magnetic field in the direction of a z-axis in a working volume. The magnet assembly includes a shim device arranged inside the cryostat for adjusting the spatial variation or homogeneity of the magnetic field generated in the working volume by the magnet coil system. The shim device comprises at least one closed superconducting shim conductor path having an HTS layer. The HTS layer forms a surface that is geometrically developable such that unwrapping onto a plane changes the geodesic distance between any two points on the surface formed by the HTS layer by no more than 10%. The inner and/or outer contour of the geometrical development of the HTS layer describes a non-convex curve.

Abstract: A layer wound magnet coil includes a central coil region and end coil regions adjoining the central coil region along an axial line of symmetry. The central coil region includes layers of coil windings of an anisotropic material. The end coil regions include layers of coil windings of the anisotropic superconducting material interspersed with layers of non-superconducting material.

Abstract: AC and/or DC testing of an optoelectronic device at the wafer level. In one example embodiment, a method of testing one or more devices at a wafer level includes generating a test signal; supplying the test signal to a single device on a wafer; providing an output of the single device to each of a plurality of devices on the wafer by way of a common electrical connection between the single device and the plurality of devices; providing an output of each of the plurality of devices to a corresponding return connection by way of electrical connections between the plurality of devices and the plurality of return connections; and receiving return currents from each of the return connections.

Abstract: A die having a semiconductor laser driven by a differential drive circuit is provided. The die provides a matched load to the drive circuit by also having a balancing load with an impedance, including both resistive and reactive components substantially identical to the load impedance of the semiconductor laser fabricated on the die. With the balancing load and semiconductor laser pair, the die prevents impedance-mismatch-induced drive problems that occur in high frequency operation, e.g., above about 1 GHz. The semiconductor laser may be a vertical cavity surface emitting laser (VCSEL), for example, as are used in high bandwidth applications like Gigabit Ethernet and Fibre Channel Applications. Furthermore, the die can form an array of balancing and semiconductor laser pairs.

Abstract: A die having a semiconductor laser driven by a differential drive circuit is provided. The die provides a matched load to the drive circuit by also having a balancing load with an impedance, including both resistive and reactive components, substantially identical to the load impedance of the semiconductor laser fabricated on the die. With the balancing load and semiconductor laser pair, the die prevents impedance-mismatch-induced drive problems that occur in high frequency operation, e.g., above about 1 GHz. The semiconductor laser may be a vertical cavity surface emitting laser (VCSEL), for example, as are used in high bandwidth applications like Gigabit Ethernet and Fibre Channel Applications. Furthermore, the die can form an array of balancing and semiconductor laser pairs.

Abstract: A versatile optical sensor method and assembly (200) is disclosed, providing cost-effective and readily adaptable optical sensor packaging while minimizing product variance, and comprising an integrally molded or single foundation piece (202) formed with a light source housing (302), a lens alignment feature (304) surrounding the light source housing, a mounting alignment feature (210), a sensor housing (206), and a barrier feature (204), further comprising a light source member (300) mounted to the foundation piece within the light source housing, a single lens member (214) enclosing the light source member and formed to engage with the lens alignment feature, and a detector member (208) mounted to the foundation piece within the sensor housing.