Abstract: An apparatus includes a rigid frame or girder system, a first computer controlled motion system associated with the rigid frame or girder system and configured to move in coordinated positions, a second computer controlled motion system associated with a part to be worked on and configured to move in coordinated positions, and a plurality of sensors associated with the first motion system and the second motion system. The first computer controlled motion system and the second computer controlled motion system use information from the plurality of sensors to assist in coordination between the first computer controlled motion system and the second computer controlled motion system.

Abstract: A method incorporating an antenna and RF circuitry into the object acting as a substrate includes modeling the object as a three-dimensional object, and designing the antenna and RF circuitry for direct placement on the surface of the object. The step of designing is at least partially based on the size, three-dimensional shape, and material properties of the surface of the object acting as the substrate. The step of designing is preferably performed through use of an evolutionary optimizer implemented using parallel computing devices.

Abstract: An apparatus for use in 3D fabrication includes a heat sink, a melt tube extending through the heat sink, the melt tube having a first end and an opposite second end and adapted for melting filament or other material as the material is conveyed from the first end to the second end, a pen tip having an opening therein for ejecting melted material, the pen tip at the second end of the melt tube, and a pen tip holder for securely holding the pen tip during printing, the pen tip holder having a heater element associated therewith.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: A flat screen display (FSD) window system includes a flat screen display, a window frame operatively connected to the flat screen display, the window frame and flat screen display configured to simulate an appearance of a window. The flat screen display window system further includes a video source operatively connected to the flat screen display to provide a video signal to the flat screen display. Methods are provided for making a window in an interior wall or a basement using FSD technology. The FSD Window System can be multi purpose to include a window, a picture, a monitor or a television.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.

Abstract: The invention provides an apparatus and methods for depositing materials on a substrate, and for performing other selected functions, such as material destruction and removal, temperature control, imaging, detection, therapy and positional and locational control. In various embodiments, the apparatus and methods are suitable for use in a tabletop setting, in vitro or in vivo.

Abstract: A method for depositing a material on a substrate includes providing an apparatus with at least one material dispenser. The method further includes positioning the pen tip at a predetermined writing gap where the predetermined writing gap is a distance of more than 75 micrometers above the substrate. The method also provides for controlling velocity of the flow of material through the outlet and dispense speed based on dispensed line height and dispensed line width parameters. An apparatus for depositing a material on a substrate is also provided which may have one or more mechanical vibrators, a pen tip with a hydrophobic surface, or multiple nozzles and pen tips on a single pump.

Abstract: An optimal configuration for at least one antenna and/or at least one frequency selective surface is generated. A configuration of elements is generated by selecting a simple configuration of at least one element and applying a genetic algorithm to the simple configuration to generate a configuration optimized for various characteristics. A stochastic process may be used to randomly select an arrangement of elements as the simple antenna configuration and to select elements that connect the randomly selected elements to produce a stochastic configuration to which the genetic algorithm is then applied. Alternatively, an iterated or semi-iterated process may be applied to the simple antenna configuration to produce a fractal or a semi-fractal configuration, respectively, to which the genetic algorithm is then applied. Also, the elements may be optimized independently.

Abstract: The invention provides an apparatus and methods for depositing materials on a substrate, and for performing other selected functions, such as material destruction and removal, temperature control, imaging, detection, therapy and positional and locational control. In various embodiments, the apparatus and methods are suitable for use in a tabletop setting, in vitro or in vivo.

Abstract: Sample preparation apparatus and method includes a wafer stage platform with an optical microscope and integrated pattern recognition to automatically address specific locations on the wafer sample of interest. A laser attaches to the optical microscope to mill a set pattern around the area of interest. A precision micro-manipulator engages the sample support structure, extracts the structure, and places the structure in a TEM holder or holder tip. The holder or holder tip can then be placed inside a FIB for final thinning, followed by direct transfer into the TEM.

Abstract: Sample preparation apparatus and method includes a wafer stage platform with an optical microscope and integrated pattern recognition to automatically address specific locations on the wafer sample of interest. A laser attaches to the optical microscope to mill a set pattern around the area of interest. A precision micro-manipulator engages the sample support structure, extracts the structure, and places the structure in a TEM holder or holder tip. The holder or holder tip can then be placed inside a FIB for final thinning, followed by direct transfer into the TEM.

Abstract: The invention provides an apparatus and methods for depositing materials on a substrate, and for performing other selected functions, such as material destruction and removal, temperature control, imaging, detection, therapy and positional and locational control. In various embodiments, the apparatus and methods are suitable for use in a tabletop setting, in vitro or in vivo.

Abstract: Concentration of a solute in a solution is determined. Light from a light source is received at a chamber containing the solute and the solution. The light is transmitted along an optical path length of the chamber, through the solute and the solution, and output from the chamber. The light output from the chamber is detected by a detector. The optical path length of the chamber is selected to optimize sensitivity of the detector. The concentration of the solute in the solution is determined based on the light received by the detector.

Abstract: Sample preparation apparatus and method includes a wafer stage platform with an optical microscope and integrated pattern recognition to automatically address specific locations on the wafer sample of interest. A laser attaches to the optical microscope to mill a set pattern around the area of interest. A precision micro-manipulator engages the sample support structure, extracts the structure, and places the structure in a TEM holder or holder tip. The holder or holder tip can then be placed inside a FIB for final thinning, followed by direct transfer into the TEM.

Abstract: A compact integrated biosensor has an integrated light source and integrated optical detectors made with gratings, dielectric coating, or prism for specific wavelength selection to define signatures that identify elements, biohazardous materials, environmentally hazardous materials, biological substance or any chemical substance on the sample holders. A micropump draws gas, ambient fluids and samples to the sample holders. Electrical signals are provided from the optical detectors on output lines to the microprocessor. A device connected to the microprocessor compares characteristic responses to actual signal parameters. An output indicates the presence (or absence) of particular biological, chemical or environmentally hazardous material. A battery, fuel cell or solar cell operated power supply provides electrical energy to the integrated light source and optical detectors.

Abstract: Concentration of a solute in a solution is determined. Light from a light source is received at a chamber containing the solute and the solution. The light is transmitted along an optical path length of the chamber, through the solute and the solution, and output from the chamber. The light output from the chamber is detected by a detector. The optical path length of the chamber is selected to optimize sensitivity of the detector. The concentration of the solute in the solution is determined based on the light received by the detector.

Abstract: The invention provides an apparatus and methods for depositing materials on a substrate, and for performing other selected functions, such as material destruction and removal, temperature control, imaging, detection, therapy and positional and locational control. In various embodiments, the apparatus and methods are suitable for use in a tabletop setting, in vitro or in vivo.

Abstract: Methods and systems are provided for embedding electrical components within a device including a frequency responsive structure, such as an antenna or a frequency selective surface. Electrical components are selected and locations for placing the selected components within the device are selected for optimizing performance characteristics of the structure. The selection may be performed by modeling the device with various electrical components embedded at various locations using, for example, a genetic algorithm. The selected components are embedded at the selected locations. The frequency responsive structure and the selected components embedded at the selected locations may be produced in the same manufacturing process. The selected electrical components may be embedded at the selected locations as contiguous and integral parts of the device and may be embedded within the frequency responsive structure.