Abstract: A heat pipe formed by metal deposition, on porous metal wick parts, which forms the enclosure and provides both a metallurgical bond to the wick and a hermetic seal.

Abstract: A thermally conductive mechanical joint is provided between two object surfaces across which it is desired to conduct heat. The joint includes metallic material of a predetermined melting point below the normal operating temperature of the joint. The metallic material is bounded by a mask forming cells of sufficiently small dimensions that the melted metallic material can withstand the anticipated loading normal to the joint and at right angles to the heat transfer direction. The metallic cells can be provided on opposite sides of a thin heat conductive layer provided between the surfaces of the joint or they can be provided directly on one of the surfaces of the joint. By proper choice of materials, the metallic material will remain in the cells even though the thermal joint is made and broken on multiple occasions.

Abstract: Cooling of electronic components on a circuit board is accomplished by a rmally conductive element such as a heat pipe that is in spaced parallel relation to the board and in contact with the upper surfaces of the components. The ends of the conductive element are forced into contact with a heat receiving and dissipating frame by a clamp device acting through the board and a lightweight spacer between the board and the conductive element.