Patents by Inventor Kenneth Hodson

Kenneth Hodson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060103019
    Abstract: Assembly methods and semiconductor device assemblies are disclosed in which corresponding IC sockets and PCB projections are used for alignment and bond formation between IC and PCB components of a completed assembly, for example, a BGA. Embodiments of the invention further provide the capability of disassembly and reassembly.
    Type: Application
    Filed: December 13, 2005
    Publication date: May 18, 2006
    Inventor: Kenneth Hodson
  • Publication number: 20050173795
    Abstract: Assembly methods and semiconductor device assemblies are disclosed in which corresponding IC sockets and PCB projections are used for alignment and bond formation between IC and PCB components of a completed assembly, for example, a BGA. Embodiments of the invention further provide the capability of disassembly and reassembly.
    Type: Application
    Filed: February 5, 2004
    Publication date: August 11, 2005
    Inventor: Kenneth Hodson