Patents by Inventor Kenneth J. Cole

Kenneth J. Cole has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109031
    Abstract: The present disclosure provides a system for processing ultramafic material. The system may comprise a reactor for accelerating weathering of said ultramafic material. The reactor may comprise one or more chambers comprising one or more microbes, biological medicators, or enzymatic accelerants to facilitate the weathering of the ultramafic material.
    Type: Application
    Filed: April 19, 2023
    Publication date: April 4, 2024
    Inventors: Stephen J. ROMANIELLO, Brian D. LEY, Douglas O. EDWARDS, Margaret G. ANDREWS, Nathan G. WALWORTH, Thomas ISHOEY, Tom C. GREEN, Francesc MONTSERRAT, Martin VAN DEN BERGHE, Kenneth NEALSON, Devon Barnes COLE, Kelly ERHART
  • Publication number: 20240077193
    Abstract: A lighting fixture arrangement, an adjustable lighting fixture connector, and a method of installing a lighting fixture arrangement.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Keith B. Enos, Kenneth E. Cole, Brian R. Charney, Patrick N. Reeves, William J. Kubiak, Brian W. Mears
  • Patent number: 9878901
    Abstract: Thick (i.e., greater than two microns), fine-grained, low-stress tungsten MEMS structures are fabricated at low temperatures, particularly for so-called “MEMS last” fabrication processes (e.g., when MEMS structures are fabricated after electronic circuitry is fabricated). Means for very accurately etching structural details from the deposited tungsten layer and for strongly and stably anchoring the tungsten layer to an underlying substrate are disclosed. Also, means for removing a sacrificial layer underlying the mobile tungsten layer without damaging the tungsten or allowing it to be drawn down and stuck by surface tension is disclosed.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: January 30, 2018
    Assignee: Analog Devices, Inc.
    Inventors: John A. Geen, George M. Molnar, Gregory S. Davis, Bruce Ma, Kenneth J. Cole, James Timony, Kenneth Flanders
  • Publication number: 20150336790
    Abstract: Thick (i.e., greater than two microns), fine-grained, low-stress tungsten MEMS structures are fabricated at low temperatures, particularly for so-called “MEMS last” fabrication processes (e.g., when MEMS structures are fabricated after electronic circuitry is fabricated). Means for very accurately etching structural details from the deposited tungsten layer and for strongly and stably anchoring the tungsten layer to an underlying substrate are disclosed. Also, means for removing a sacrificial layer underlying the mobile tungsten layer without damaging the tungsten or allowing it to be drawn down and stuck by surface tension is disclosed.
    Type: Application
    Filed: March 27, 2015
    Publication date: November 26, 2015
    Inventors: John A. Geen, George M. Molnar, Gregory S. Davis, Bruce Ma, Kenneth J. Cole, James Timony, Kenneth Flanders