Patents by Inventor Kenneth J. Cross

Kenneth J. Cross has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11894286
    Abstract: A hermetically sealed electronics module includes a core IC installed on a substrate. A collar surrounds the core IC and is sealed to the substrate and to a lid, forming a sealed chamber. A heat spreader bonded to an internal surface of the lid extends downward into proximal thermal contact with the core IC. A thin layer of TIM can be applied between the heat spreader and core IC. The heat spreader does not overlap any tall components that extend above the core IC, and can extend over regions adjacent to the core IC. Tall components can be limited to a periphery of the chamber, and/or the heat spreader can include openings that surround central tall components. The heat spreader can be soldered or welded to the lid over an entire upper surface of the heat spreader. X-ray and/or CSAM scanning can detect heat spreader bonding flaws.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: February 6, 2024
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Keith K Sturcken, Kenneth J. Cross, Michael J. O'Connor
  • Publication number: 20220051966
    Abstract: A hermetically sealed electronics module includes a core IC installed on a substrate. A collar surrounds the core IC and is sealed to the substrate and to a lid, forming a sealed chamber. A heat spreader bonded to an internal surface of the lid extends downward into proximal thermal contact with the core IC. A thin layer of TIM can be applied between the heat spreader and core IC. The heat spreader does not overlap any tall components that extend above the core IC, and can extend over regions adjacent to the core IC. Tall components can be limited to a periphery of the chamber, and/or the heat spreader can include openings that surround central tall components. The heat spreader can be soldered or welded to the lid over an entire upper surface of the heat spreader. X-ray and/or CSAM scanning can detect heat spreader bonding flaws.
    Type: Application
    Filed: June 13, 2019
    Publication date: February 17, 2022
    Inventors: Keith K. Sturcken, Kenneth J. Cross, Michael J. O'Connor
  • Patent number: 7836267
    Abstract: A method for backing up a computer-readable data file with a computerized backup application, where the data file is open and locked for exclusive access by an owning application that is mutually independent of the backup application. The backup application by-passes the lock on the data file. Any write operations to the data file by the owning application are intercepted and delayed. The address range of any write operations directed to the data file by the owning application during the backup procedure are written to a change log file, where the change log file contains no indication of the content of the write operations. At least a portion of the data file is copied to a backup file, and any intercepted and delayed write operations are passed on to the data file after the data to be overwritten has been copied to the backup file.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: November 16, 2010
    Assignee: Barracuda Networks Inc
    Inventor: Kenneth J. Cross