Patents by Inventor Kenneth J. Kirsten

Kenneth J. Kirsten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an electrical connection using solder flux compatible with flip chip underfill material
    Patent number: 6615484
    Abstract: A method is provided in which an epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a cross-linking agent with inherent flux activity. When heated the cross-linking agent cleans the metal oxides from the metal surfaces on the chip and then reacts with the epoxy resin to form a thermosetting epoxy residue. The flux residue left on the board after soldering does not inhibit the flow of an underfill encapsulant. The underfill binds to the thermosetting residue of the flux which increases adhesion strength preventing delamination of the chip during thermal cycling.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: September 9, 2003
    Assignee: Litton Systems, Inc.
    Inventor: Kenneth J. Kirsten
  • Solder flux compatible with flip-chip underfill material
    Publication number: 20020095783
    Abstract: An epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a cross-linking agent with inherent flux activity. When heated the cross-linking agent cleans the metal oxides from the metal surfaces on the chip and then reacts with the epoxy resin to form a thermosetting epoxy residue. The flux residue left on the board after soldering does not inhibit the flow of an underfill encapsulant. The underfill binds to the thermosetting residue of the flux which increases adhesion strength preventing delamination of the chip during thermal cycling.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 25, 2002
    Inventor: Kenneth J. Kirsten
  • Solder flux compatible with flip-chip underfill material
    Patent number: 6367150
    Abstract: An epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a cross-linking agent with inherent flux activity. When heated the cross-linking agent cleans the metal oxides from the metal surfaces on the chip and then reacts with the epoxy resin to form a thermosetting epoxy residue. The flux residue left on the board after soldering does not inhibit the flow of an underfill encapsulant. The underfill binds to the thermosetting residue of the flux which increases adhesion strength preventing delamination of the chip during thermal cycling.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: April 9, 2002
    Assignee: Northrop Grumman Corporation
    Inventor: Kenneth J. Kirsten