Abstract: A process for recovering copper and copper oxide for spent ammoniacal etchant, electroless and copper persulfate bath fluids used in the manufacture of copper printed wiring boards such that the treated baths contain no ammonia. The spent solutions are placed in a cooking vessel having its inner surface made of titanium and the formaldehyde is added. The ingredients are then stirred while air is bubbled through the ingredients until thoroughly mixed after which the pH of the mixture is adjusted to between 12.0 and 14.0. The adjusted mixture is now heated to a temperature within the range of 200.degree.-210.degree. F. and air is bubbled through the heated mixture until copper and copper oxide precipitates form in the mixture. After the precipitates form the mixture is allowed to cool to permit the precipitates to settle to the bottom of the vessel and the mixture is decanted from the vessel. The copper and copper oxide precipitates are washed and then collected.