Abstract: A helmet light bar coupleable to a helmet includes a housing, a plurality of light-emitting modules associated with the housing, and a controller adapted to active one or more of the plurality of light-emitting modules responsive to either or both of a signal indicative of activation of emergency lights on a motor vehicle and a signal indicative of a level of intensity of deceleration of the motor vehicle.

Abstract: A helmet adapted to be wearable by an operator of a motor vehicle includes a shell, one or more light-emitting modules associated with the shell, and a controller. The controller is adapted to activate the at least one light-emitting module responsive to a signal indicative of activation of emergency lights on the motor vehicle. A camera module that includes a housing and a camera may be associated with the shell. The controller may be adapted to activate the camera responsive to a signal indicative that the helmet is in proximity to the motor vehicle.

Abstract: A helmet light bar coupleable to a helmet includes a housing, a plurality of light-emitting modules associated with the housing, and a controller adapted to active one or more of the plurality of light-emitting modules responsive to either or both of a signal indicative of activation of emergency lights on a motor vehicle and a signal indicative of a level of intensity of deceleration of the motor vehicle.

Abstract: Wafer level testing of a wafer (500) is accomplished by dividing the integrated circuits of the wafer into a plurality of segmented bus regions (514, 516, and 518 for example). Each bus region is formed having its own set of test conductors (520-530) wherein each set of test conductors are isolated from all other sets of test conductors on the wafer. Each test conductor has at least one contact pad (531-546) where each contact pad lies within a periphery of the integrated circuits' active areas. By forming pads over ICs and by sub-dividing the bus structure of test conductive lines, more high powered ICs can be tested in a wafer-level manner with fewer problems associated with speed, power, throughput, and routing problems.

Abstract: A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

Abstract: A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

Abstract: A process for detecting software errors in a computer program and automatically gathering diagnostic data limited to the error to be resolved. Error detection code is placed within the software program during program development. When an error or failure is detected, this process is called and captures only the data required to debug the software error. The error detection code notifies the process of which data to capture by selecting entries from a table within the process. This table, known as an Application Data Table (ADT), contains the layout and format of all data areas used by the calling problem program and information required to build a generic alert and send the generic alert to a computer network monitor program. This process is only called conditionally when an error is detected. It is completely idle until such a condition occurs.

Abstract: A method for handling semiconductor components by utilizing a removable filler strip for temporarily securing or clinching longitudinally arrangeable individual components in a tube, rod or hollow magazine. The filler strip is generally flat, but has surface features that serve to press the components against the top, bottom or side of the tube. Partial removal of the filler strip will result in the dispensing of some of the components while the remainder are retained by the filler strip in the tube.

Abstract: A filler strip for temporarily securing or clinching longitudinally arrangeable individual components in a tube, rod or hollow magazine. The filler strip is generally flat, but has surface features that serve to press the component against the top, bottom or side of the tube to prevent the component from knocking against adjacent components and cracking, chipping or otherwise damaging one or more of the components. The filler strip is particularly suited to eliminating the knocking motion of expensive ceramic integrated circuit packages that are shipped and handled in transparent plastic tubes or rails.