Patents by Inventor Kenneth J. Lubert

Kenneth J. Lubert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fine pitch circuitization with filled plated through holes
    Patent number: 6618940
    Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: September 16, 2003
    Assignee: International Business Machines Corporation
    Inventors: Kenneth J. Lubert, Curtis L. Miller, Thomas R. Miller, Robert D. Sebesta, James W. Wilson, Michael Wozniak
  • Avoiding polymer fill of alignment sites
    Patent number: 6379772
    Abstract: A substrate comprising at least one optical fiducial hole and a plurality of holes surrounding at least substantially one-half of the at least one optical fiducial hole.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: April 30, 2002
    Assignee: International Business Machines Corporation
    Inventor: Kenneth J. Lubert
  • Fine pitch circuitization with filled plated through holes
    Publication number: 20010050183
    Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.
    Type: Application
    Filed: July 19, 2001
    Publication date: December 13, 2001
    Inventors: Kenneth J. Lubert, Curtis L. Miller, Thomas R. Miller, Robert D. Sebesta, James W. Wilson, Michael Wozniak
  • Fine pitch circuitization with filled plated through holes
    Patent number: 6291779
    Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: September 18, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kenneth J. Lubert, Curtis L. Miller, Thomas R. Miller, Robert D. Sebesta, James W. Wilson, Michael Wozniak