Abstract: A surface preparation process has been developed for aluminum and aluminum alloy substrates that greatly improves the resulting bond. The process improves bond strength, fracture toughness, durability and failure mode of adhesive bonds. The process also decreases the sensitivity of aluminum substrates to processing variables such as humidity, temperature and hence the processing timelines. The process involves treating an aluminum surface with a solution of an alkali metal metasilicate, and subsequently treating the surface with a solution of an organofunctional silane. Employing this two step process, bonding to the aluminum substrate is improved.