Patents by Inventor Kenneth Jai
Kenneth Jai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8725910Abstract: A cable detection circuit for a device, set forth by way of example and not limitation, includes a generator circuit operative to provide currents on a line of a communication interface. A controller is coupled to the generator circuit and operative to detect an amount of capacitance on the line based on the provided currents. The controller is operative provide an output based on the detected amount of capacitance, the output indicating whether a cable is connected to the device via the communication interface.Type: GrantFiled: August 9, 2011Date of Patent: May 13, 2014Assignee: Maxim Integrated Products, IncInventors: Leonardo Sala, Kenneth Jay Helfrich
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Patent number: 8714416Abstract: A handle attachment configured to provide a secure handle for a spray can and enable the operation of a dispenser valve of the spray can. The attachment includes a housing that defines a grip, a cap coupled to the housing, and an actuation device pivotally mounted to the housing. The cap has a C-shaped rim surrounding an opening that is sized to accommodate a valve mounting cup of the spray can. The rim has a lower portion in which a flange and slots are defined. The slots enable the lower portion of the rim to deflect radially outward relative to the remainder of the rim above the slots. The rigidity of the rim above its lower portion is increased with a ring that compresses the rim above the lower portion and/or a shoulder that defines an increased wall thickness of the cap above the lower portion.Type: GrantFiled: November 16, 2011Date of Patent: May 6, 2014Inventor: Kenneth Jay Becker
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Publication number: 20140089552Abstract: A universal serial bus (USB) hub includes a USB AFE circuit module, a hub core and an isolator circuit module interposed between the USB AFE circuit module and the hub core. Data communications between the hub core and the first USB AFE circuit module pass through the isolator circuit module. A method for communicating through a universal serial bus hub includes providing a USB AFE circuit module, providing a hub core, providing an isolator circuit module interposed between the USB AFE circuit module and the hub core, and directing communication from the USB AFE circuit module to the hub core through the isolator circuit module.Type: ApplicationFiled: September 21, 2012Publication date: March 27, 2014Inventors: Leonardo Sala, Kenneth Jay Helfrich
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Publication number: 20140038942Abstract: The present invention relates to compounds according to Formula (I) or a pharmaceutically acceptable salt or solvate thereof. Such compounds can be used in the treatment of RORgammaT-mediated diseases or condition.Type: ApplicationFiled: February 10, 2012Publication date: February 6, 2014Applicants: Merck Sharp & Dohme B.V., Merck Sharp & Dohme Corp.Inventors: Willem Frederik Johan Karstens, Mario Van Der Stelt, Jos Cals, Rita Corte Real Goncalves Azevedo, Kenneth Jay Barr, Hongjun Zhang, Richard Thomas Beresis, Dongshan Zhang, Xiaobang Duan
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Patent number: 8448612Abstract: A propane fueled combustor for providing a controlled heat flux environment of twenty to two hundred kilowatts per square meter. The combustor has the capability of generating a repeatable and quantifiable environment in which to evaluate a response of an energetic material to a fast cook off hazard, such as a liquid fuel fire.Type: GrantFiled: April 5, 2007Date of Patent: May 28, 2013Assignee: The United States of America as Represented by the Secretary of the NavyInventors: Kenneth Jay Wilson, Travis Shane Laker, Ephraim Berk Washburn, Alice Irene Atwood
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Publication number: 20120292337Abstract: A handle attachment configured to provide a secure handle for a spray can and enable the operation of a dispenser valve of the spray can. The attachment includes a housing that defines a grip, a cap coupled to the housing, and an actuation device pivotally mounted to the housing. The cap has a C-shaped rim surrounding an opening that is sized to accommodate a valve mounting cup of the spray can. The rim has a lower portion in which a flange and slots are defined. The slots enable the lower portion of the rim to deflect radially outward relative to the remainder of the rim above the slots. The rigidity of the rim above its lower portion is increased with a ring that compresses the rim above the lower portion and/or a shoulder that defines an increased wall thickness of the cap above the lower portion.Type: ApplicationFiled: November 16, 2011Publication date: November 22, 2012Inventor: Kenneth Jay Becker
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Patent number: 8290171Abstract: In an example embodiment a headset includes a phone jack, a speaker connected to the phone jack, a microphone coupled to the phone jack and a resistive switch string coupled to the phone jack to the same ring of the phone jack as the microphone. In another example an integrated circuit device includes a charge pump, a multi-voltage LDO having an input which is capable of being coupled to an output of the charge pump, an ADC; and a pull-up resistor coupled between an output of the LDO and an input of the ADC. In another example embodiment, a method for headset signal multiplexing includes providing a headset with a plurality of signal sources and voltage division multiplexing the plurality of signal sources on a common wire.Type: GrantFiled: August 20, 2009Date of Patent: October 16, 2012Assignee: Maxim Integrated Products, Inc.Inventors: Kenneth Jay Helfrich, Larry D. Barnes
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Patent number: 8272542Abstract: A handle attachment for mounting to a standardized valve mounting cup of a spray can and operating a push-type dispenser valve. The handle attachment includes a housing that defines a grip and a cap configured to couple with an outer diameter of the valve mounting cup. An actuation device is pivotally mounted to the housing and includes a trigger portion disposed adjacent the grip and a finger portion disposed within the cap for actuating the push-type dispenser valve. A C-shaped rim is disposed on the cap and defines a central opening sized to accommodate the valve mounting cup, a base located on the axis of symmetry of the rim, a circumferential gap located on the axis of symmetry diametrically opposite the base and separating two ends of the rim, and at least one slot disposed between the base and a diametrical chord perpendicular to the axis of symmetry.Type: GrantFiled: February 27, 2009Date of Patent: September 25, 2012Assignee: SafeWorld International Inc.Inventor: Kenneth Jay Becker
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Publication number: 20120214105Abstract: A propane fueled combustor for providing a controlled heat flux environment of twenty to two hundred kilowatts per square meter. The combustor has the capability of generating a repeatable and quantifiable environment in which to evaluate a response of an energetic material to a fast cook off hazard, such as a liquid fuel fire.Type: ApplicationFiled: April 5, 2007Publication date: August 23, 2012Inventors: Kenneth Jay Wilson, Travis Shane Laker, Ephraim Berk Washburn, Alice Irene Atwood
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Patent number: 8159040Abstract: A semiconductor structure and a method for fabricating the semiconductor structure provide a field effect device located and formed upon an active region of a semiconductor substrate and at least one of a fuse structure, an anti-fuse structure and a resistor structure located and formed at least in part simultaneously upon an isolation region laterally separated from the active region within the semiconductor substrate. The field effect device includes a gate dielectric comprising a high dielectric constant dielectric material and a gate electrode comprising a metal material. The at least one of the fuse structure, anti-fuse structure and resistor structure includes a pad dielectric comprising the same material as the gate dielectric, and optionally, also a fuse, anti-fuse or resistor that may comprise the same metal material as the gate electrode.Type: GrantFiled: May 13, 2008Date of Patent: April 17, 2012Assignee: International Business Machines CorporationInventors: Douglas D. Coolbaugh, Ebenezer E. Eshun, Ephrem G. Gebreselasie, Zhong-Xiang He, Herbert Lei Ho, Deok-kee Kim, Chandrasekharan Kothandaraman, Dan Moy, Robert Mark Rassel, John Matthew Safran, Kenneth Jay Stein, Norman Whitelaw Robson, Ping-Chuan Wang, Hongwen Yan
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Publication number: 20120082166Abstract: In an embodiment, an analog front end (AFE) bridge for a SLPI PHY includes: an AFE LINK-side circuit having at least one pair of differential LINK-side nodes which does not conform to SLPI PHY specifications; an AFE PHY-side circuit having a pair of differential PHY-side nodes conforming to SLPI PHY specifications, wherein the AFE PHY-side circuit is coupled to the AFE LINK-side circuit; and a termination control circuit coupled to the AFE PHY-side circuit. A method of bridging a legacy LINK circuit to a SLPI PHY circuit includes: communicating with a legacy LINK circuit with a legacy LINK protocol; communicating with a SLPI PHY circuit with a SLPY PHY protocol over a differential pair; converting outputs of the legacy LINK circuit into inputs of the SLPI PHY circuit; converting outputs of the SLPI PHY circuit into inputs of the legacy LINK circuit; controlling a termination of the differential pair.Type: ApplicationFiled: September 30, 2010Publication date: April 5, 2012Inventors: Leonardo Sala, Danilo Ranieri, Kenneth Jay Helfrich
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Patent number: 8064580Abstract: Inmate communications systems provide a feature-rich platform with a high degree of flexibility and security employing call control facilities located off institutional premises. Authentication processes for calling and called party verification include biometric techniques in some embodiments. Distributed processing of call control and billing provide flexible interactive call payment processes. Preferred embodiments feature voice over IP transmission and control featuring controlled access to avoid addition of unauthorized third-party call participants. Monitoring, recording and selective forwarding of calls is provided under control of system administrators.Type: GrantFiled: September 2, 2005Date of Patent: November 22, 2011Assignee: Confinement Telephony Technology, LLCInventors: Wesley Larry Apple, Timothy Edwin Pabon, Kenneth Jay Gumbiner, William Ryan
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Patent number: 8064613Abstract: The coupling of an electret microphone is detected and identifying whether there is monaural or stereo speakers coupled to the USB connector is accomplished by coupling a current source to the USB ID terminal and detecting the voltage on the ID terminal. If the voltage on the ID line is substantially below the voltage associated with any other accessory when an electret microphone is coupled between the ID terminal and the ground terminal, and a microphone bias resistor is coupled to the ID line. On detection of an electret microphone being coupled between the ID terminal and the ground terminal, whether there is a monaural or stereo speakers coupled to the USB connector is determined by detecting the impedance on the one of the D+ and D? terminals to which a monaural speaker would not be coupled. An open circuit indicates a monaural speaker, otherwise stereo speakers are connected. An alternate embodiment is disclosed.Type: GrantFiled: March 3, 2008Date of Patent: November 22, 2011Assignee: Maxim Integrated Products, Inc.Inventor: Kenneth Jay Helfrich
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Publication number: 20110129996Abstract: A through substrate via includes an annular conductor layer at a periphery of a through substrate aperture, and a plug layer surrounded by the annular conductor layer. A method for fabricating the through substrate via includes forming a blind aperture within a substrate and successively forming and subsequently planarizing within the blind aperture a conformal conductor layer that does not fill the aperture and plug layer that does fill the aperture. The backside of the substrate may then be planarized to expose at least the planarized conformal conductor layer.Type: ApplicationFiled: February 11, 2011Publication date: June 2, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Peter James Lindgren, Edmund Juris Sprogis, Anthony Kendall Stamper, Kenneth Jay Stein
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Patent number: 7898063Abstract: A through substrate via includes an annular conductor layer at a periphery of a through substrate aperture, and a plug layer surrounded by the annular conductor layer. A method for fabricating the through substrate via includes forming a blind aperture within a substrate and successively forming and subsequently planarizing within the blind aperture a conformal conductor layer that does not fill the aperture and plug layer that does fill the aperture. The backside of the substrate may then be planarized to expose at least the planarized conformal conductor layer.Type: GrantFiled: February 16, 2008Date of Patent: March 1, 2011Assignee: International Business Machines CorporationInventors: Peter James Lindgren, Edmund Juris Sprogis, Anthony Kendall Stamper, Kenneth Jay Stein
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Patent number: 7802043Abstract: Methods and apparatus for adding an autonomous controller to an existing architecture such as by way of example, portable devices such as cell phones, MP3 players, and digital cameras. A circuit interposed between the memory card and the system controller of the device is controllable to couple the memory card to the system controller, or to couple the memory card to a high speed I/O controller on the circuit. When the memory card is coupled to the high speed I/O controller on the circuit, the circuit provides signals to the system controller indicative of a memory card removal event. In systems having an I/O connection such as a USB connection, the circuit also disconnects that connection from the system controller, provides signals to the system control indicative of a USB disconnect and connects the I/O connection to the memory card through a high speed data transfer unit to provide a higher speed I/O capability. Various features and capabilities are disclosed.Type: GrantFiled: May 9, 2006Date of Patent: September 21, 2010Assignee: Maxim Integrated Products, Inc.Inventors: Lane Thomas Hauck, Kenneth Jay Helfrich, David Alan Podsiadlo
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Patent number: 7741722Abstract: A through-wafer via structure and method for forming the same. The through-wafer via structure includes a wafer having an opening and a top wafer surface. The top wafer surface defines a first reference direction perpendicular to the top wafer surface. The through-wafer via structure further includes a through-wafer via in the opening. The through-wafer via has a shape of a rectangular plate. A height of the through-wafer via in the first reference direction essentially equals a thickness of the wafer in the first reference direction. A length of the through-wafer via in a second reference direction is at least ten times greater than a width of the through-wafer via in a third reference direction. The first, second, and third reference directions are perpendicular to each other.Type: GrantFiled: March 23, 2007Date of Patent: June 22, 2010Assignee: International Business Machines CorporationInventors: Paul Stephen Andry, Edmund Juris Sprogis, Kenneth Jay Stein, Timothy Dooling Sullivan, Cornelia Kang-I Tsang, Ping-Chuan Wang, Bucknell C. Webb
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Publication number: 20100051652Abstract: A handle attachment for mounting to a standardized valve mounting cup of a spray can and operating a push-type dispenser valve. The handle attachment includes a housing that defines a grip and a cap configured to couple with an outer diameter of the valve mounting cup. An actuation device is pivotally mounted to the housing and includes a trigger portion disposed adjacent the grip and a finger portion disposed within the cap for actuating the push-type dispenser valve. A C-shaped rim is disposed on the cap and defines a central opening sized to accommodate the valve mounting cup, a base located on the axis of symmetry of the rim, a circumferential gap located on the axis of symmetry diametrically opposite the base and separating two ends of the rim, and at least one slot disposed between the base and a diametrical chord perpendicular to the axis of symmetry.Type: ApplicationFiled: February 27, 2009Publication date: March 4, 2010Applicant: SAFEWORLD INTERNATIONAL INC.Inventor: Kenneth Jay Becker
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Publication number: 20090283840Abstract: A semiconductor structure and a method for fabricating the semiconductor structure provide a field effect device located and formed upon an active region of a semiconductor substrate and at least one of a fuse structure, an anti-fuse structure and a resistor structure located and formed at least in part simultaneously upon an isolation region laterally separated from the active region within the semiconductor substrate. The field effect device includes a gate dielectric comprising a high dielectric constant dielectric material and a gate electrode comprising a metal material. The at least one of the fuse structure, anti-fuse structure and resistor structure includes a pad dielectric comprising the same material as the gate dielectric, and optionally, also a fuse, anti-fuse or resistor that may comprise the same metal material as the gate electrode.Type: ApplicationFiled: May 13, 2008Publication date: November 19, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Douglas D. Coolbaugh, Ebenezer E. Eshun, Ephrem G. Gebreselasie, Zhong-Xiang He, Herbert Lei Ho, Deok-kee Kim, Chandrasekharan Kothandaraman, Dan Moy, Robert Mark Rassel, John Matthew Safran, Kenneth Jay Stein, Norman Whitelaw Robson, Ping-Chuan Wang, Hongwen Yan
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Publication number: 20090206488Abstract: A through substrate via includes an annular conductor layer at a periphery of a through substrate aperture, and a plug layer surrounded by the annular conductor layer. A method for fabricating the through substrate via includes forming a blind aperture within a substrate and successively forming and subsequently planarizing within the blind aperture a conformal conductor layer that does not fill the aperture and plug layer that does fill the aperture. The backside of the substrate may then be planarized to expose at least the planarized conformal conductor layer.Type: ApplicationFiled: February 16, 2008Publication date: August 20, 2009Applicant: International Business Machines CorporationInventors: Peter James Lindgren, Edmund Juris Sprogis, Anthony Kendall Stamper, Kenneth Jay Stein