Patents by Inventor Kenneth K. Claasen

Kenneth K. Claasen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packages
    Patent number: H73
    Abstract: A package for wire-bonded semiconductor integrated circuit chips is disclosed. The chip is covered by a protective layer of material such as room temperature vulcanizing silicone rubber. The thickness of the layer is such that it covers a portion of the arched wires, thereby concentrating the stresses away from the wire-ball bond interfaces. The chip is encapsulated in a plastic material while providing an air gap between the plastic and protective layer.
    Type: Grant
    Filed: August 25, 1983
    Date of Patent: June 3, 1986
    Assignee: AT&T Bell Laboratories
    Inventors: Kenneth K. Claasen, Ronald N. Graver, Frank P. Pelletier, Kurt M. Striny, Ronald J. Wozniak