Abstract: A sensor is provided for changing an operational characteristic of a circuit within a housing structure of the sensor to a preselected stimulus. The circuit within the housing structure is provided with magnetically sensitive components to change an operational parameter thereof. An object is provided to change the status of the magnetically sensitive component. The present invention incorporates a Hall effect element within the housing structure that is placed proximate a permanent magnet. Between the magnet and the Hall effect element a depression is formed to permit the insertion of a magnetically permeable object to change the magnetic field. The change in the magnetic field creates a change in the status of the Hall effect element and permits the circuit to change its operational characteristic.

Abstract: A connector is made by cutting a continuous strip of conductive material to provide individual fingers that extend in a direction perpendicular to the length of the strip. The fingers are individually bent to offset their distal ends from their connective ends. The process defines bend lines on each of the fingers and then bends the fingers to offset their distal ends from their respective connective ends in directions perpendicular to the plane of the conductive strip and along its length. After appropriately bending each of the fingers, a nonconductive material is molded around the group of fingers. Following the molding operation, the connective ends of the fingers are severed from the uncut portion of the strip to singular an electrical connector from the continuous strip of connectors.

Abstract: A method is described for manufacturing a plurality of proximity sensors which are attached to a printed circuit board during the manufacturing steps and subsequently severed from the printed circuit board by shearing. Each of the proximity sensors comprises a core and coil assembly, a plurality of electronic components and an electrical connector. These components of each of the proximity sensors is encapsulated during an overmolding process and the encapsulations are removed from the printed circuit board by a shearing step. Each of the encapsulations can be inserted into a cylindrical housing.