Abstract: An electrode for cardiac signal sensing includes an intermediate layer, an iridium-containing layer, an iridium oxide layer, an insulating polymer layer, and a conductive layer formed on a flexible polymer substrate. The intermediate metal layer has a first portion and a second portion, and is formed on the conductive layer. The iridium-containing layer includes at least 50 wt. % iridium and has a first portion and a second portion, and is formed on the first portion of the intermediate metal layer. The iridium oxide layer is formed on the first portion of the iridium-containing layer. The insulating polymer layer is formed on the second portion of the intermediate metal layer and the second portion of the iridium-containing layer. The iridium-containing layer is not formed on the second portion of the intermediate metal layer; and the iridium oxide layer is not formed on the second portion of the iridium-containing layer.

Abstract: An electrode for cardiac signal sensing includes an intermediate layer, an iridium-containing layer, an iridium oxide layer, an insulating polymer layer, and a conductive layer formed on a flexible polymer substrate. The intermediate metal layer has a first portion and a second portion, and is formed on the conductive layer. The iridium-containing layer includes at least 50 wt. % iridium and has a first portion and a second portion, and is formed on the first portion of the intermediate metal layer. The iridium oxide layer is formed on the first portion of the iridium-containing layer. The insulating polymer layer is formed on the second portion of the intermediate metal layer and the second portion of the iridium-containing layer. The iridium-containing layer is not formed on the second portion of the intermediate metal layer; and the iridium oxide layer is not formed on the second portion of the iridium-containing layer.

Abstract: An implantable lead may have a distal assembly including a coupler, a terminal pin and a conductive member rotatably secured to both the coupler and the terminal pin. The conductive member may be a fine-wire, multiple-filar coil. The conductive member may be welded to the coupler and/or the terminal pin by welding through banded portions formed within the distal and proximal ends, respectively, of the conductive member.

Abstract: An implantable lead may have a distal assembly including a coupler, a terminal pin and a conductive member rotatably secured to both the coupler and the terminal pin. The conductive member may be a fine-wire, multiple-filar coil. The conductive member may be welded to the coupler and/or the terminal pin by welding through banded portions formed within the distal and proximal ends, respectively, of the conductive member.

Abstract: The embodiments herein relate to a connection body for welding a conductor member to a functional lead component such as a fixation base or terminal pin. The various connection body embodiments each have at least one slot defined in a wall of the connection body at which the conductor member is laser welded to the connection body.

Abstract: An implantable lead may have a distal assembly including a coupler, a terminal pin and a conductive member rotatably secured to both the coupler and the terminal pin. The conductive member may include a coating that is at least partially removed before securing the conductive member to the coupler and the terminal pin. The coating may be removed in a process combining, in sequence, an IR laser and a UV laser.

Abstract: An implantable lead may have a distal assembly including a coupler, a terminal pin and a conductive member rotatably secured to both the coupler and the terminal pin. The conductive member may be a fine-wire, multiple-filar coil. The conductive member may be welded to the coupler and/or the terminal pin by welding through banded portions formed within the distal and proximal ends, respectively, of the conductive member.

Abstract: An implantable lead may have a distal assembly including a coupler, a terminal pin and a conductive member rotatably secured to both the coupler and the terminal pin. The conductive member may include a coating that is at least partially removed before securing the conductive member to the coupler and the terminal pin. The coating may be removed in a process combining, in sequence, an IR laser and a UV laser.

Abstract: The embodiments herein relate to a connection body for welding a conductor member to a functional lead component such as a fixation base or terminal pin. The various connection body embodiments each have at least one slot defined in a wall of the connection body at which the conductor member is laser welded to the connection body.