Abstract: A microelectronic multilayer ceramic package combines a high temperature cofired ceramic (HTCC) module or carrier with a low temperature cofired ceramic (LTCC) module or carrier using a bonding interface layer of electrically nonconductive epoxy having electrically conductive regions for providing electrical interconnection between carriers. The bonding layer also has regions of thermally conductive material for interfacing heat sources on one carrier with heat dissipators on another carrier. The bonding layer also has apertures which allow prominent structures extending from one carrier to pass though and into a corresponding cavity in another carrier.

Abstract: A sealable hermetic microchip package includes a vent therein that permits gas to escape during the sealing operation, but then itself is sealed at the completion of the sealing operation to render the package hermetic. The venting of gas from the interior of the package avoids the buildup of internal pressure during the sealing operation that can introduce bubbles and other faults into the sealing material. The vent may be a channel in the sealing surface of the lid of the package that is initially open, and then fills with the seal material as it flows to effect the seal. The vent may also be a hole in the lid that is sealed by the flow of a bead of the seal material. An equivalent approach to venting provided that the lid be mounted on standoffs that flow during sealing to permit the lid to settle onto the base of the package.

Abstract: A pin grid array package includes an electrically insulating, moisture impervious base having a plurality of bores therethrough, electrically conducting pins extending through the bores, metallic collars wedged between the pins and the bores adjacent the bottom side of the base, an electrically conducting trace formed of a silver-2 percent platinum alloy extending from each pin to the location for attachment of an electrical device, and a melted eutectic bond between the metal of the conducting path and the head of the pin at the top side of the base.