Patents by Inventor Kenneth L. Minnerly

Kenneth L. Minnerly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit heat pipe heat spreader with through mounting holes
    Patent number: 7028760
    Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: April 18, 2006
    Assignee: Thermal Corp.
    Inventors: Peter M. Dussinger, Thomas L. Myers, John H. Rosenfeld, Kenneth L. Minnerly
  • Integrated circuit heat pipe heat spreader with through mounting holes
    Patent number: 6896039
    Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: May 24, 2005
    Assignee: Thermal Corp.
    Inventors: Peter M. Dussinger, Thomas L. Myers, John H. Rosenfeld, Kenneth L. Minnerly
  • Integrated circuit heat pipe heat spreader with through mounting holes
    Publication number: 20040244951
    Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
    Type: Application
    Filed: May 7, 2004
    Publication date: December 9, 2004
    Inventors: Peter M. Dussinger, Thomas L. Myers, John H. Rosenfeld, Kenneth L. Minnerly