Abstract: A precursor component structure (and a method for forming the precursor component) for a printed circuit board (PCB). The precursor component structure includes a primary composite sheet having a primary upper foil sheet, a primary lower foil sheet and a primary dielectric sheet located therebetween. The primary composite sheet has a desired material set. The primary upper foil sheet is for ultimate use as an external layer of the PCB. The primary lower foil sheet has a primary micro-via hole formed therein that extends through the primary dielectric sheet to a lower surface of the primary upper foil. A primary electrically conductive layer is formed over surfaces of the primary dielectric sheet defining the primary micro-via hole. Thus, a primary electrically conductive path is formed from the primary upper foil sheet to the primary lower foil sheet using these “inverted micro-vias”.