Patents by Inventor Kenneth Latzko

Kenneth Latzko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alignment of integrated circuit chip stack
    Patent number: 9171742
    Abstract: The present disclosure relates to methods and devices for manufacturing a three-dimensional chip package. A method includes forming a linear groove on an alignment rail, attaching an alignment rod to the linear groove, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail. Another method includes forming an alignment ridge on an alignment rail, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: October 27, 2015
    Assignee: GLOBALFOUNDRIES U.S. 2 LLC
    Inventors: Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth Latzko, Qinghuang Lin, Peter J. Sorce, Sri M. Sri-Jayantha, Robert L. Wisnieff, Roy R. Yu
  • ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK
    Publication number: 20150024549
    Abstract: The present disclosure relates to methods and devices for manufacturing a three-dimensional chip package. A method includes forming a linear groove on an alignment rail, attaching an alignment rod to the linear groove, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail. Another method includes forming an alignment ridge on an alignment rail, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 22, 2015
    Applicant: International Business Machines Corporation
    Inventors: Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth Latzko, Qinghuang Lin, Peter J. Sorce, Sri M. Sri-Jayantha, Robert L. Wisnieff, Roy R. Yu