Abstract: A multilayer moisture barrier film includes at least one desiccant-containing layer disposed adjacent to at least one desiccant free layer, where the at least one desiccant-containing layer comprises a polymeric matrix defining a plurality of cavities and desiccant particles, wherein at least one of the plurality of cavities has at least one desiccant particle in communication therewith.

Abstract: A multilayer moisture barrier film includes a first outer layer, a second outer layer, and at least one desiccant-containing inner layer between the first and second outer layers. The inner layer can have cavities with which the desiccant particles are in communication.

Abstract: PSA Label Rolls using spent liners and a novel continuous process to convert a stack of face material into a roll of label stock by affixing adhesive coated face material onto a liner. Provides a process to recycle waste liner from conventional roll label stock application machines. Uses an ultra-high solids adhesive that needs no drying. Roll label stock made by such a process provides large cost savings and beneficial environmental impact.

Abstract: A multilayer moisture barrier film includes a first outer layer, a second outer layer, and at least one desiccant-containing inner layer between the first and second outer layers. The inner layer can have cavities with which the desiccant particles are in communication.

Abstract: Processing and use of ultra-high solids formulations wherein no drying step is needed for the formulation to be incorporated in a wide variety of applications. Adhesives, top-coatings, sealants, fasteners are amongst the use areas.

Abstract: A rigid tubular mouthpiece for a smoking article may include a cushioning wrapping material thereabout. The wrapping material may be configured to form several layers, encompassed by a polymeric label, which may include indicia. The wrapping material will provide a lower durometer, as applied, than the unwrapped mouthpiece, which may be incorporated as part of a smoking article.

Abstract: A process for making an ultra high solids emulsion adhesive that is coatable and dryable at room temperature. The process consists of increasing solids using a phase inversion process to accomplish the addition of increased solids into aqueous formulations thereby obtaining emulsion pressure sensitive adhesives with solids content in excess of 60%.

Abstract: A process for making an ultra high solids emulsion adhesive that is coatable and dryable at room temperature. The process consists of increasing solids using a phase inversion process to accomplish the addition of increased solids into aqueous formulations thereby obtaining emulsion pressure sensitive adhesives with solids content in excess of 60%.

Abstract: A method and system for providing targeted advertising to consumers is disclosed. Identifying information for a consumer is received. A credit attribute for the consumer using the identifying information is retrieved. At least one advertisement is stored in which each advertisement includes a corresponding credit attribute range. An advertisement for presentation to the consumer is selected based on the credit attribute of the consumer and the credit attribute range of the advertisement.

Abstract: A photo album is provided having an ink-receptive coating on a surface of the photo album. A user may write text or draw pictures on the surface with an ink pen, such as with a gel-based ink pen. The ink-receptive coating protects the ink from smudging or smearing after the ink has dried. Consequently, the text and/or picture is durable. The writable or drawable surface may be the front or back exterior surface, and/or an interior surface.

Abstract: A method of making electrically conductive bumps of improved height on a semiconductor device. The method includes steps of depositing an under bump metallurgy over a semiconductor device onto a contact pad; depositing and patterning a photoresist layer to provide an opening over the under bump metallurgy; depositing a first electrically conductive material into the opening in the photoresist layer; depositing a second electrically conductive material over the first electrically conductive material; removing the photoresist layer and the excess under bump metallurgy; applying a flux agent to the top surface of the second electrically conductive material; hard baking the semiconductor device to remove any oxide; dipping a portion of the semiconductor device in an electroless plating solution; removing the semiconductor device from the electroless plating solution; and reflowing the electrically conductive materials to provide a bump of improved height on the semiconductor device.

Abstract: A device for controlling emission of electrons from an arc chamber of a plasma flood system into an ion beam in an ion implanter for implanting ions into a substrate. In one embodiment, the invention comprises a mechanical shutter disposed in a discharge opening between the arc chamber and the plasma guide tube of the implanter. The bore size of the shutter can be selectively varied in order to control the emission of electrons from the arc chamber into the ion beam in the plasma guide tube. In another embodiment, the invention comprises an electron-attracting probe which is disposed in the discharge opening.

Abstract: A method of making electrically conductive bumps of improved height on a semiconductor device. The method includes steps of depositing an under bump metallurgy over a semiconductor device onto a contact pad; depositing and patterning a photoresist layer to provide an opening over the under bump metallurgy; depositing a first electrically conductive material into the opening in the photoresist layer; depositing a second electrically conductive material over the first electrically conductive material; removing the photoresist layer and the excess under bump metallurgy; applying a flux agent to the top surface of the second electrically conductive material; hard baking the semiconductor device to remove any oxide; dipping a portion of the semiconductor device in an electroless plating solution; removing the semiconductor device from the electroless plating solution; and reflowing the electrically conductive materials to provide a bump of improved height on the semiconductor device.

Abstract: Within a method for forming a microelectronic fabrication there is first provided a substrate. There is then formed over the substrate a patterned conductor layer having a topographic variation at a periphery of the patterned conductor layer. There is then formed over the substrate and passivating the topographic variation at the periphery of the patterned conductor layer a planarizing passivation layer formed of a thermally reflowable material. There is then formed upon the planarizing passivation layer a dimensionally stabilizing layer. Finally, there is then thermally annealed the microelectronic fabrication to form from the planarizing passivation layer a thermally annealed planarizing passivation layer. By employing formed upon the planarizing passivation layer the dimensionally stabilizing layer, there is attenuated within the thermally annealed planarizing passivation layer replication of the topographic variation at the periphery of the patterned conductor layer.

Abstract: A photo album is provided having an ink-receptive coating on a surface of the photo album. A user may write text or draw pictures on the surface with an ink pen, such as with a gel-based ink pen. The ink-receptive coating protects the ink from smudging or smearing after the ink has dried. Consequently, the text and/or picture is durable. The writable or drawable surface may be the front or back exterior surface, and/or an interior surface.

Abstract: A composition for making glossy, ink-receptive coatings for recording media contains a water soluble, nonionic polymer, a water soluble, amphoteric copolymer, and a polyalkylene glycol or silicone surfactant. Ink-receptive constructions made with the composition also are provided.

Abstract: A method for removing a multiplicity of solder bodies connected to a semiconductor wafer through a copper wetting layer from the semiconductor wafer is disclosed. In the method, a semiconductor wafer that has on a top surface a multiplicity of solder bodies electrically connected to a multiplicity of bond pads through a multiplicity of copper wetting layers is first provided. When the multiplicity of solder bodies is found out of specification or must be removed for any other quality reasons, the semiconductor wafer is exposed to an etchant that has an etch rate toward the copper wetting layer at least 5 times the etch rate toward a metal that forms the multiplicity of bond pads. The semiconductor wafer may be removed from the etchant when the multiplicity of copper wetting layers is substantially dissolved such that the multiplicity of solder bodies is separated from the multiplicity of bond pads. The multiplicity of solder bodies may be either solder bumps or solder balls.

Abstract: A label assembly includes concealed promotional material, and is secured to the product package with the assembly including water-soluble adhesive. The promotional material may be in the form of a "cents-off" coupon or a scratch-off lottery-type game piece. The use of water-soluble adhesive deters tampering prior to purchase of the product, and the coupon or game piece is subsequently exposed when the water soluble adhesive is washed away. The label assembly may include either one, two, or three layers, with the lowermost label being secured to a backing strip or web preparatory to application to the product. When a single layer is employed, it is opaque, and the promotional material is on its lower surface. In a three-layer unit, the game piece may be sandwiched between an outer label having water-soluble adhesive, and the base label which is provided with permanent pressure-sensitive adhesive.