Abstract: A sit ski for an athlete includes a ski, a bucket disposed above the ski and configured to support the athlete, and a suspension disposed between the ski and the bucket. The suspension includes a support frame coupled to the ski, a first rotatable member rotatably coupled to the bucket and to the support frame, a second rotatable member rotatably coupled to the bucket and to the support frame, a shock coupled to the bucket and to the support frame, and a bump stop configured to contact the bucket.

Abstract: An integrated circuit assembly includes a support (e.g., package substrate or circuit board) and a semiconductor die including a device. The semiconductor die is mounted to the support with the device facing the support. The device can be, for example, a quantum well laser device or a photonics device. A layer of decoupling material is on the device. An underfill material is between the semiconductor die and the support, where the decoupling material is between the device and the underfill material. The decoupling layer decouples stress from transferring from the underfill material into the device. For example, the decoupling material forms only weak bonds with the underfill material and/or a passivation layer on the device, in an embodiment. Weak bonds include non-covalent bonds and non-ionic bonds, for example. The decoupling material can be, for instance, a PTFE film, a poly(p-xylylene) film, a fluorocarbon, or a compound lacking free hydroxyl groups.

Abstract: A device for securing sliding windows and doors includes a telescoping bar and a plate. An end of the bar and the plate together form a connector pair that couples the bar end to the plate in one of a separable orientation and an inseparable orientation according to a relative angle between the bar end and the plate. The connector pair allows the bar to be separated from the plate in the separable orientation when the relative angle is a first angle, and the connector pair prevents the bar end being separated from the plate in the inseparable orientation when the relative angle is a second angle. A lock in the locked position physically prevents the relative angle between the bar end and the plate being changed from the second angle to the first angle. A T-bar or side-wing may prevent unlocking when the window or door is open.

Abstract: An integrated circuit assembly includes a support (e.g., package substrate or circuit board) and a semiconductor die including a device. The semiconductor die is mounted to the support with the device facing the support. The device can be, for example, a quantum well laser device or a photonics device. A layer of decoupling material is on the device. An underfill material is between the semiconductor die and the support, where the decoupling material is between the device and the underfill material. The decoupling layer decouples stress from transferring from the underfill material into the device. For example, the decoupling material forms only weak bonds with the underfill material and/or a passivation layer on the device, in an embodiment. Weak bonds include non-covalent bonds and non-ionic bonds, for example. The decoupling material can be, for instance, a PTFE film, a poly(p-xylylene) film, a fluorocarbon, or a compound lacking free hydroxyl groups.

Abstract: A window security device has a support rod capable of securely contacting an upper window frame and a lower window frame. The device has two horizontal arms extending from away from the support rod terminating in thin blades capable of sliding between a first stationary window and a second sliding window sash. The device prevents unwanted tampering with the device by children located on the inside of the window as well as burglars located on the exterior of the window and to be easily removed in the event of a fire. The length of the device's blade can be adjusted allow a window to safely remain open a specified distance, and the device's arms can be adjusted to fit many different widths of windows. When the blades are disposed between the windows, the window is slid open and contacts the window stop, located at the end of the horizontal arms.

Abstract: A window security device has a support rod capable of securely contacting an upper window frame and a lower window frame. The device has two horizontal arms extending from away from the support rod terminating in thin blades capable of sliding between a first stationary window and a second sliding window sash. The device prevents unwanted tampering with the device by children located on the inside of the window as well as burglars located on the exterior of the window and to be easily removed in the event of a fire. The length of the device's blade can be adjusted allow a window to safely remain open a specified distance, and the device's arms can be adjusted to fit many different widths of windows. When the blades are disposed between the windows, the window is slid open and contacts the window stop, located at the end of the horizontal arms.

Abstract: A game for play between opposing teams on a field involves a resilient ring that is thrown by a team member to be caught by another member of the same team. The field is marked to display a rectangular playing area having a midfield location and scoring or URT areas extending across opposing ends of the playing area. Supplemental scoring or PAU areas are marked by fiat rings situated a predetermined distance beyond the ends of the playing area. Scoring occurs when a player on offense catches the resilient ring within the defense URT area. Supplemental scoring occurs when the player on the offense throws the ring from the defense URT area to come to rest in the defense PAU area.

Abstract: An adhesive bonded nutplate assembly is provided for mounting onto a substrate, particularly such as a composite substrate having an opening therein for passage of a fastener such as a bolt or screw. The nutplate assembly includes an integral liner sleeve to project through the substrate opening when the nutplate assembly is mounted thereon. An installation tool includes a tapered nose in combination with a pulling mandrel to pull and separate a fixture pin from the nutplate assembly while flaring a leading edge of the liner sleeve to lock the nutplate assembly in place.

Abstract: An automatic gain control (AGC) system to be used in record/playback mode erein input signals over a wide dynamic range are recorded in the field. The recorded signals are then played back using the AGC system in order to recover the amplitudes of the original signals with high fidelity. The AGC system obtains record/playback gain reciprocity in the record and playback modes and thus effectively nullifies inherent gain control nonlinearity.

Abstract: A semiconductor package for protecting a semiconductor chip such as a Very Large Scale Integration chip and connecting it to an electrical circuit is disclosed. The chip is bonded to a section of Tape Automated Bonding, (TAB), tape which contains a number of leads thereover, each lead has an inner lead section bonded to the chip and an outer lead section that extends beyond the outer perimeter of the tape, for connecting to the circuit. The chip is enclosed in a housing which subtends an area slightly larger than the chip itself. The inner lead sections project from the TAB tape into the housing and are bonded to the chip. A metal layer under the TAB tape is connected to a number of the leads. After the semiconductor package of this invention is assembled, the outer leads are attached to the associated circuit so as to connect the chip to the circuit. The metal layer serves as a reference plane so the leads connected thereto supply a voltage that does not very to sub-circuits on the chip.

Abstract: A lightweight mirror comprises a silicon carbide (SiC) foam core having a bulk density of approximately five percent. The mirror further comprises two solid facesheets each of which is integrally formed upon a surface of the SiC foam core, the facesheets being comprised of SiC. Upon a machined surface of one or both of the facesheets a further layer of SiC is deposited to reinforce the SiC facesheet and to provide an optically polishable surface. This outer layer of SiC may be deposited by chemical vapor deposition (CVD) techniques. After depositing this reinforcing layer of SiC, the layer is machined and polished to provide a mirror surface having a desired flatness and optical quality.

Abstract: A package for housing fabricated semiconductor chips is disclosed. The package has ceramic base with a raised outer shelf extending around its periphery. The outer shelf defines a space in the package where the chip is seated. A lead frame with a number of individual conductive leads is disposed over the outer shelf. A section of tape automated bonding tape is used to provide electrical connections between bonding points on the chip and the lead frame leads; the tape automated bonding tape carries a number of conductive leads each of said leads having an inner lead portion attached to a chip bonding point, and an outer lead portion attached to a lead frame lead. A frame is secured over the base outer shelf so the lead frame is embedded therebetween. A lid is secured over the frame to completely enclose the chip within the package.

Abstract: A graphite fiber reinforced silica matrix composite comprising a plurality of graphite fibers bonded together in a silica matrix comprised of silica, boron phosphate and beta-spodumene modified with a minor amount of an alkaline earth metal oxide is disclosed. The extremely low, nearly zero, coefficient of thermal expansion coupled with the moderate thermal conductivity and low density of the composite make the composite particularly suitable as a substrate material for high energy laser mirrors.

Abstract: A method is disclosed for the treatment of a petroleum charge stock which comprises the treatment of said petroleum charge stock with an aqueous solution containing a metal phthalocyanine compound and a compound selected from the group consisting of an alkali metal sulfide and an alkali metal sulfite.