Abstract: A method of constructing a liquid crystal display element or similar article of manufacture includes providing a first transparent substrate bondable to a second transparent substrate. The second transparent substrate has a plurality of vias passing through opposing active faces. A dispensing technique is used to fill the vias void-free with an optical grade adhesive material to form the LCD element.

Abstract: A method of positioning an image sensor relative to a mounting body wherein the lens mount assembly comprises a substantially planar mounting surface disposed substantially parallel to a lens mount reference surface. The method comprises the steps of: constraining the mounting body in a predetermined position; identifying a predetermined distance from the lens mount reference surface to define a mounting position, the predetermined distance being measured along an axis substantially perpendicular to the lens mount reference surface toward the mounting surface; applying an adhesive to the mounting surface; applying the image sensor to the adhesive such that the image sensor is positioned at the mounting position; and curing the adhesive to securely mount the image sensor to the mounting surface at the mounting position.

Abstract: An apparatus introduces fluid in vias formed in an LCD element free of voids or air bubbles in the fluid material. A support base secures the LCD element in place during fluid flow from a fluid dispenser positioned proximate to the LCD element. Fluid flow is facilitated by thermal energy from a heating element arranged in thermal contact with the support base.

Abstract: A method of delivering fluid into constricted openings arranged in a workpiece substantially eliminates the occurrence of voids or air bubbles in the fluid filling the constricted orifices. Coextensive recesses are formed in a support base for securing the workpiece from movement during fluid flow. The constricted openings are exposed to the recesses so that fluid introduced into the openings do not overflow.

Abstract: An apparatus introduces fluid in vias formed in an LCD element free of voids or air bubbles in the fluid material. A support base secures the LCD element in place during fluid flow from a fluid dispenser positioned proximate to the LCD element. Fluid flow is facilitated by thermal energy from a heating element arranged in thermal contact with the support base.

Abstract: A method of delivering fluid into constricted openings arranged in a workpiece substantially eliminates the occurrence of voids or air bubbles in the fluid filling the constricted orifices. Coextensive recesses are formed in a support base for securing the workpiece from movement during fluid flow. The constricted openings are exposed to the recesses so that fluid introduced into the openings do not overflow.

Abstract: A liquid crystal display element includes a deck plate in the form of a first transparent substrate adhesively bonded to a signal plate in the form of a second transparent substrate wherein the signal plate has a plurality of vias passing through the second substrate. The vias are filled void-free with an optical grade material to form the LCD element.

Abstract: A method of constructing a liquid crystal display element or similar article of manufacture includes providing a first transparent substrate bondable to a second transparent substrate. The second transparent substrate has a plurality of vias passing through opposing active faces. A dispensing technique is used to fill the vias void-free with an optical grade adhesive material to form the LCD element.

Abstract: A liquid crystal display and method of making same has a first transparent substrate bondable to a second transparent substrate. The second transparent substrate has a plurality of vias passing through opposing active surfaces of the second transparent substrate. Vias are filled void-free with an optical grade adhesive material when the first and second transparent substrates are bonded together.

Abstract: A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability.

Abstract: A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability. IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb--Sn solder balls are employed for joining. These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy. Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.

Abstract: A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct chip mount. The chip has at least one solder ball with a cap of low melting point metal. The surface of the carrier has electrical features that are directly connected to the low melting point metal on the solder ball of the chip to form the eutectic and this way the chip is directly attached to the carrier.

Abstract: Small, closely spaced deposits of solder materials may be formed with high volumetric accuracy and uniformity of shape by depositing a layer of conductive material over surfaces of a dielectric layer having apertures or recesses (e.g. blind apertures) and conductors and/or pads exposed by those apertures or recesses, masking regions of the conductive material with a further patterned dielectric layer, electroplating solder materials onto regions of the conductive material exposed by the mask, removing the mask and portions of the conductive material by selective etching and reflowing solder away from at least a portion of the surfaces of the apertured dielectric layer. Uniformity of electroplating within blind apertures is enhanced by a combination of fluid jet sparging and cathode agitation. Excess conductor material in the resulting solder deposit can be avoided by replacing conductor material with a constituent component of a solder material in an immersion bath prior to electroplating.

Abstract: A new rework process for semiconductor chips mounted in a flip chip configuration, via solder balls, on an organic substrate is disclosed.

Abstract: A controlled collapse chip connect method of joining an IC chip to a microelectronic circuit card. According to the method an inhomogeneous, anisotropic column of solder is deposited from a Pb/Sn alloy onto solder wettable I/O terminals of the I/C chip, without subsequent homogenizing reflow. The solder core has a Pb rich core and an Sn rich cap. The matching footprint of the solder wettable I/O terminals on the microelectronic circuit card is substantially free of deposited solder and presents a protected Cu surface to the solder columns, or, at most a surface of Cu and anti-oxidant. The chip is aligned with the corresponding footprints on the microelectronic circuit card, and the solder is reflowed to bond the chip to the microelectronic circuit card.