Abstract: A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

Abstract: A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

Abstract: A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

Abstract: A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

Abstract: Efficient PAM transmit modulation is provided by a PAM modulator that includes an oscillator (404) that provides a clock signal, CKV, (408). The clock signal 408 and a delayed version (CKV_DLY) 420 of the clock signal are provided to a logic gate (414). The output of logic gate (414) is used as a power amplifier input signal (PA_IN) for radio frequency power amplifier (416). Depending on the relative time delay of the CKV clock signal (408) and the CKV_DLY delayed clock signal (420), the timing and duty cycle of the logic gate (414) duty cycle can be controlled. The duty cycle or pulse-width variation affects the turn-on time of the power amplifier (416); thereby establishing the RF output amplitude.

Abstract: A phase-domain digital PLL loop is implemented using a hybrid of predictive and closed-loop architecture that allows direct DCO oscillator transmit modulation in the GFSK modulation scheme of “BLUETOOTH” or GSM, as well as the chip phase modulation of the 802.11b or Wideband-CDMA. The current gain of the DCO oscillator is predicted by observing past phase error responses to previous DCO corrections. DCO control is then augmented with the “open-loop” instantaneous frequency jump estimate of the new frequency control word.

Abstract: A technique of time dithering a fully digitally-controlled oscillator (DCO) tuning input employs a shift register 1306 and a multiplexer 1308 responsive to a sigma-delta modulated delay control to minimize spurious tones generated by a DCO 200. The shift register 1306 is clocked via a divided-down high-frequency reference provided by the DCO 200 output signal. The multiplexer 1308 is clocked via a frequency reference that is reclocked and synchronized to the DCO 200 output signal. The multiplexer 1308 output is thus time dithered in response to a delay control to minimize perturbations caused by switching.

Abstract: A technique of time dithering a fully digitally-controlled oscillator (DCO) tuning input employs a shift register 1306 and a multiplexer 1308 responsive to a sigma-delta modulated delay control to minimize spurious tones generated by a DCO 200. The shift register 1306 is clocked via a divided-down high-frequency reference provided by the DCO 200 output signal. The multiplexer 1308 is clocked via a frequency reference that is reclocked and synchronized to the DCO 200 output signal. The multiplexer 1308 output is thus time dithered in response to a delay control to minimize perturbations caused by switching.