Patents by Inventor Kenneth Marston

Kenneth Marston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11410905
    Abstract: A heat spreader is disclosed with regions where material is absent to reduce the mass/weight of the heat spreader without substantially reducing the temperature of the semiconductor chip and without substantially affecting the warpage and mechanical stress/strain in the electronic package.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: August 9, 2022
    Assignee: International Business Machines Corporation
    Inventors: Kamal K. Sikka, Kenneth Marston, Tuhin Sinha, Shidong Li
  • Publication number: 20200303279
    Abstract: A heat spreader is disclosed with regions where material is absent to reduce the mass/weight of the heat spreader without substantially reducing the temperature of the semiconductor chip and without substantially affecting the warpage and mechanical stress/strain in the electronic package.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 24, 2020
    Inventors: Kamal K. Sikka, Kenneth Marston, Tuhin Sinha, Shidong Li
  • Publication number: 20080002363
    Abstract: A direct liquid jet impingement module and associated method of providing such used in cooling of electronic components housed in an electronic package is provided. The module comprises a frame having an orifice to be placed over to-be-cooled components. A manifold is then disposed over the frame, such that the manifold opening is aligned with the frame orifice to ultimately enable fluid impingement on the to-be-cooled components. The manifold is formed to receive an inlet for the flow of coolants and an outlet fitting for removal of dissipated heat. A jet orifice plate is also provided inside the manifold opening, aligned with the frame orifice for directing fluid coolant flow over to-be-cooled components.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 3, 2008
    Applicant: International Business Machines Corporation
    Inventors: Levi Campbell, Rehan Choudhary, Michael Ellsworth, Kenneth Marston, Hilton Toy
  • Publication number: 20060056156
    Abstract: A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.
    Type: Application
    Filed: September 10, 2004
    Publication date: March 16, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David Long, Glenn Daves, David Edwards, Ronald Hering, Sushumna Iruvanti, Kenneth Marston, Jason Miller