Patents by Inventor Kenneth Michael Gessner

Kenneth Michael Gessner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesion of a substrate onto a CMC component
    Patent number: 11285711
    Abstract: Methods for adhering a substrate onto a surface of a ceramic component are provided. The method may include applying a first bond coating onto an attachment surface of the substrate, applying a first alumina coating onto the first bond coating on the attachment surface of the substrate, applying a second bond coating onto an outer surface of the ceramic component, applying a second alumina coating onto the second bond coating on the attachment surface of the substrate, applying a cement onto at least one of the first alumina coating and the second alumina coating, and adhering the attachment surface of the substrate onto the outer surface of the ceramic component. Connections between a metal substrate and a ceramic matrix composite component are also provided.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: March 29, 2022
    Assignee: General Electric Company
    Inventors: Daniel James Aug, Joshua Daniel Brown, Aaron Michael Dziech, Joseph Herbert Fields, Kenneth Michael Gessner
  • ADHESION OF A SUBSTRATE ONTO A CMC COMPONENT
    Publication number: 20220088912
    Abstract: Methods for adhering a substrate onto a surface of a ceramic component are provided. The method may include applying a first bond coating onto an attachment surface of the substrate, applying a first alumina coating onto the first bond coating on the attachment surface of the substrate, applying a second bond coating onto an outer surface of the ceramic component, applying a second alumina coating onto the second bond coating on the attachment surface of the substrate, applying a cement onto at least one of the first alumina coating and the second alumina coating, and adhering the attachment surface of the substrate onto the outer surface of the ceramic component. Connections between a metal substrate and a ceramic matrix composite component are also provided.
    Type: Application
    Filed: December 7, 2021
    Publication date: March 24, 2022
    Inventors: Daniel James Aug, Joshua Daniel Brown, Aaron Michael Dziech, Joseph Herbert Fields, Kenneth Michael Gessner
  • Adhesion of a Substrate onto a CMC Component
    Publication number: 20180297346
    Abstract: Methods for adhering a substrate onto a surface of a ceramic component are provided. The method may include applying a first bond coating onto an attachment surface of the substrate, applying a first alumina coating onto the first bond coating on the attachment surface of the substrate, applying a second bond coating onto an outer surface of the ceramic component, applying a second alumina coating onto the second bond coating on the attachment surface of the substrate, applying a cement onto at least one of the first alumina coating and the second alumina coating, and adhering the attachment surface of the substrate onto the outer surface of the ceramic component. Connections between a metal substrate and a ceramic matrix composite component are also provided.
    Type: Application
    Filed: April 18, 2017
    Publication date: October 18, 2018
    Inventors: Daniel James Aug, Joshua Daniel Brown, Aaron Michael Dziech, Joseph Herbert Fields, Kenneth Michael Gessner